ADVANCED FINISHING CONTROL

• US 20130189801A1
• Filed: 01/14/2013
• Published: 07/25/2013
• Est. Priority Date: 11/06/1998
• Status: Abandoned Application

• Current Assignee: Semcon Tech LLC (IPNav)
• Original Assignee: Semcon Tech LLC (IPNav)
• Inventors: Molnar, Charles J.
• Application Number:
  US13/741,256
• Publication Number:
  US 20130189801A1
• Time in Patent Office: Days
• US Class Current: 438/8
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step
• CPC Class Codes: H01L 21/3212 by chemical mechanical polishing [CMP]
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A finishing operation for a workpiece involves supplying an organic boundary lubricant to an operative finishing interface located between a finishing apparatus finishing element finishing surface and a surface of the workpiece being finished, and sensing in situ finishing information with an operative sensor. A change for a process control parameter is determined using the in situ finishing information, information from metrology equipment operatively coupled to the finishing apparatus, and information related to the finishing apparatus. An operative controller thereafter changes the process control parameter to change a processing control at least in part related to the finishing operation.

Claims

1. A method for processing a workpiece, the method comprising:

while performing, using a finishing apparatus, a finishing operation on a workpiece supported in a workpiece holder, supplying a finishing aid to an operative finishing interface located between a finishing element finishing surface and a surface of the workpiece being finished, and sensing in situ finishing information with an operative sensor;

determining, using at least one processor operatively coupled to the finishing apparatus, a change for a process control parameter according to a family of processing information comprising the in situ finishing information and information at least in part related to the finishing apparatus; and

changing, with an operative controller, the process control parameter to change a processing control at least in part related to the finishing operation.

2. The method of claim 1 wherein the process control parameter is changed in situ.

3. The method of claim 1 wherein the process control parameter is changed in real time.

4. The method of claim 1 wherein the change for the process control parameter is further determined according to information from at least one piece of metrology equipment operatively coupled to the finishing apparatus, which information is at least in part related to the finishing operation performed on the workpiece.

5. A method for processing a workpiece, the method comprising:

while performing, using a planarizing apparatus, a planarizing operation on a workpiece supported in a workpiece holder, supplying a finishing aid to an operative planarizing interface located between a planarizing element planarizing surface and a surface of the workpiece being finished, and sensing in situ planarizing information with an operative sensor;

determining, using at least one processor operatively coupled to the planarizing apparatus, a change for a process control parameter according to a family of processing information comprising the in situ planarizing information and information at least in part related to the planarizing apparatus; and

changing, with an operative controller, the process control parameter to change a processing control at least in part related to the planarizing operation.

6. The method of claim 5 wherein the process control parameter is changed in situ.

7. The method of claim 5 wherein the process control parameter is changed in real time.

8. The method of claim 5 wherein the change for the process control parameter is further determined according to information from at least one piece of metrology equipment operatively coupled to the finishing apparatus, which information is at least in part related to the planarizing operation performed on the workpiece

9. A method for processing a workpiece, the method comprising:

while performing, using a polishing apparatus, a polishing operation on a workpiece supported in a workpiece holder, supplying a finishing aid to an operative polishing interface located between a polishing element polishing surface and a surface of the workpiece being polished, and sensing in situ polishing information with an operative sensor;

determining, using at least one processor operatively coupled to the polishing apparatus, a change for a process control parameter according to a family of processing information comprising the in situ polishing information and information at least in part related to the polishing apparatus; and

changing, with an operative controller, the process control parameter to change a processing control at least in part related to the polishing operation.

10. The method of claim 9 wherein the process control parameter is changed in situ.

11. The method of claim 9 wherein the process control parameter is changed in real time.

12. The method of claim 9 wherein the change for the process control parameter is further determined according to information from at least one piece of metrology equipment operatively coupled to the finishing apparatus, which information is at least in part related to the polishing operation performed on the workpiece