SELECTIVE FORMATION OF METALLIC FILMS ON METALLIC SURFACES
First Claim
1. A method for selectively depositing a film on a substrate comprising a first metal surface and a second dielectric surface, the method comprising one or more deposition cycles, each cycle comprising:
- contacting the substrate with a first precursor comprising silicon or boron to selectively form a layer of first material comprising Si or B on the first metal surface relative to the second dielectric surface; and
converting the first material on the first metal surface to a second metallic material by exposing the first material to a second precursor comprising metal, wherein the method has a selectivity for depositing material on the first surface relative to the second surface of above about 50%.
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Abstract
Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In preferred embodiments, a first precursor forms a layer or adsorbed species on the first surface and is subsequently reacted or converted to form a metallic layer. Preferably the deposition temperature is selected such that a selectivity of above about 90% is achieved.
73 Citations
35 Claims
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1. A method for selectively depositing a film on a substrate comprising a first metal surface and a second dielectric surface, the method comprising one or more deposition cycles, each cycle comprising:
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contacting the substrate with a first precursor comprising silicon or boron to selectively form a layer of first material comprising Si or B on the first metal surface relative to the second dielectric surface; and converting the first material on the first metal surface to a second metallic material by exposing the first material to a second precursor comprising metal, wherein the method has a selectivity for depositing material on the first surface relative to the second surface of above about 50%. - View Dependent Claims (2, 3, 4, 6, 7, 9, 10, 11, 13, 14, 15, 16, 17, 18, 19, 21, 22, 24, 25, 26, 28, 29, 30, 32, 34)
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5. (canceled)
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8. (canceled)
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12. (canceled)
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20. (canceled)
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23. (canceled)
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27. (canceled)
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31. (canceled)
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33. A method for selectively depositing a film on a substrate comprising a first copper surface and a second dielectric surface, the method comprising one or more deposition cycles:
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contacting the substrate with a first precursor comprising silicon to selectively form a layer of first material comprising Si or B over the first copper surface relative to the second dielectric surface; and converting the first material to a second metallic material by subsequently exposing the first material to a second precursor comprising a metal fluoride;
wherein the temperature of the substrate is selected such that the first material forms on the first surface with a selectivity of greater than about 90% versus the second surface. - View Dependent Claims (35)
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Specification