METHOD FOR MANUFACTURING PACKAGED LIGHT EMITTING DIODE

• US 20130192064A1
• Filed: 09/21/2010
• Published: 08/01/2013
• Est. Priority Date: 09/21/2010
• Status: Active Grant

• Current Assignee: Rodan (Taiwan) Ltd.
• Original Assignee: Kuo-Kuang Chang
• Inventors: Chang, Kuo-Kuang
• Granted Patent: US 9,204,558 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 29/15 Thermal insulation
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method for manufacturing packaged LED is provided in the present invention. A vacuum closed space is enclosed by a base plate and a cover plate, and LED chip on the base plate is disposed in the closed space. The cover plate includes a fluorescent layer, and space between the fluorescent layer and the LED chip is vacuum. Thus, heat generated by the LED chip may not affect fluorescent material inside the fluorescent layer so that the package of LED becomes more durable.

Claims

1. A method for manufacturing packaged LED, including steps of;

material preparation;

preparing a base plate and a cover plate, the base plate having a first face and a second face, the cover plate having a third face and a fourth face, a flange being formed on one of the second face of the base plate and the third face of the cover plate, a recess being enclosed by the flange, the cover plate including a fluorescent layer;

circuit setting up;

setting up at least one LED circuit on the second face of the base plate, the LED circuit including at least one LED chip;

fixation;

fixing the cover plate onto the base plate in vacuum so that the recess is closed to form a closed space, the LED circuit being located in the closed space.

2. The method for manufacturing packaged LED of claim 1, wherein the cover plate is the fluorescent layer, the fluorescent material is distributed inside the cover plate.

3. The method for manufacturing packaged LED of claim 2, wherein the cover plate is a glass plate.

4. The method for manufacturing packaged LED of claim 1, wherein the cover further includes a protection layer located on the fourth face of the cover plate.

5. The method for manufacturing packaged LED of claim. 1, wherein in the step of fixation, the cover plate is fixed to the base plate by a photopolymer therebetween.

6. The method for manufacturing packaged LED of claim 1, wherein the third face of the cover plate forms with bumpy patterns.

7. The method for manufacturing packaged LED of claim 1, wherein the fourth face of the cover plate forms with bumpy patterns.