SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD
First Claim
1. A semiconductor light-emitting device including an optical axis comprising:
- a base board having a mounting surface and a conductor pattern formed on the mounting surface, and the mounting surface including an outer circumference;
a frame formed in a tubular shape and being located on the outer circumference of the mounting surface of the base board;
at least one semiconductor light-emitting chip having a bottom surface, a side surface and a top surface including a center, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps;
a transparent plate having a top surface, a side surface and a bottom surface, and being located over the top surface of the at least one semiconductor light-emitting chip so that the top surface of the at least one semiconductor light-emitting chip covers the bottom surface of the transparent plate;
a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the side surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer includes a convex surface, which extends toward the frame at a location between the side surface of the at least one semiconductor light-emitting chip and the side surface of the transparent plate;
a reflective layer having a side surface, the side surface of the reflective layer including a concave surface in contact with the convex surface of the side surface of the wavelength converting layer, the reflective layer disposed at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent plate and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board while surrounding the solder bumps, wherein the side surface of the reflective layer contacts with at least the side surface of the wavelength converting layer and a part of the side surface of the transparent plate, and thereby the reflective layer seals the wavelength converting layer along with the transparent plate and the at least one semiconductor light-emitting chip; and
wherein the optical axis of the semiconductor light-emitting device extends substantially normal with respect to the top surface of the at least one semiconductor light-emitting chip from substantially the center of the top surface of the at least one semiconductor light-emitting chip.
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Accused Products
Abstract
A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a casing having a cavity and a mounting surface, the chip mounted on the mounting surface, a transparent plate mounted on the wavelength converting layer within a top surface of the chip and a reflective layer located in the cavity so as to surround the transparent plate, the wavelength converting layer and the chip. The semiconductor light-emitting device can be configured to improve light-colored variability and light-emitting efficiency of the chip by using the reflective layer as a reflector, and therefore can emit a wavelength-converted light having a substantially uniform color tone and a high light-emitting efficiency from a smaller light-emitting surface than the top surface of the chip.
16 Citations
20 Claims
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1. A semiconductor light-emitting device including an optical axis comprising:
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a base board having a mounting surface and a conductor pattern formed on the mounting surface, and the mounting surface including an outer circumference; a frame formed in a tubular shape and being located on the outer circumference of the mounting surface of the base board; at least one semiconductor light-emitting chip having a bottom surface, a side surface and a top surface including a center, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps; a transparent plate having a top surface, a side surface and a bottom surface, and being located over the top surface of the at least one semiconductor light-emitting chip so that the top surface of the at least one semiconductor light-emitting chip covers the bottom surface of the transparent plate; a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the side surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer includes a convex surface, which extends toward the frame at a location between the side surface of the at least one semiconductor light-emitting chip and the side surface of the transparent plate; a reflective layer having a side surface, the side surface of the reflective layer including a concave surface in contact with the convex surface of the side surface of the wavelength converting layer, the reflective layer disposed at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent plate and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board while surrounding the solder bumps, wherein the side surface of the reflective layer contacts with at least the side surface of the wavelength converting layer and a part of the side surface of the transparent plate, and thereby the reflective layer seals the wavelength converting layer along with the transparent plate and the at least one semiconductor light-emitting chip; and wherein the optical axis of the semiconductor light-emitting device extends substantially normal with respect to the top surface of the at least one semiconductor light-emitting chip from substantially the center of the top surface of the at least one semiconductor light-emitting chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 17, 18)
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13. A semiconductor light-emitting device comprising:
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a base board having a mounting surface and a conductor pattern formed on the mounting surface, and the mounting surface including an outer circumference; a frame formed in a tubular shape and being located on the outer circumference of the mounting surface of the base board; at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps; a transparent plate having a top surface, a side surface and a bottom surface, and being located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the at least one semiconductor light-emitting chip; a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the side surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer includes a convex surface, which extends toward the frame at a position between the side surface of the at least one semiconductor light-emitting chip and the side surface of the transparent plate; and a reflective layer having a side surface, the side surface of the reflective layer including a concave surface in contact with the convex surface of the side surface of the wavelength converting layer, the reflective layer disposed at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent plate and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board while surrounding the solder bumps, wherein the side surface of the reflective layer contacts with at least the side surface of the wavelength converting layer and a part of the side surface of the transparent plate, and thereby the reflective layer seals the wavelength converting layer along with the transparent plate and the at least one semiconductor light-emitting chip. - View Dependent Claims (14, 15, 16, 19, 20)
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Specification