DIELECTRIC MATERIALS FOR POWER TRANSFER SYSTEM

• US 20130193770A1
• Filed: 07/27/2012
• Published: 08/01/2013
• Est. Priority Date: 07/28/2011
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Krishna, Kalaga Murali, Matani, Lohit
• Granted Patent: US 9,954,580 B2
• Time in Patent Office: Days
• US Class Current: 307/104
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: H01P 11/008 Manufacturing resonators
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A power transfer system is provided. The power transfer system includes a field-focusing element including a dielectric material. The dielectric material includes a ceramic material and a polymer material. The ceramic material includes an oxide compound comprising titanium and the polymer material includes a resin.

Claims

1. A power transfer system comprising:

a field-focusing element comprising a dielectric material, wherein the dielectric material comprises;

a ceramic material comprising an oxide compound comprising titanium; and

a polymer material comprising a resin.

2. The power transfer system of claim 1, wherein the oxide compound is selected from the group consisting of titania, titanate, fluoride doped titania, and fluoride doped titanate.

3. The power transfer system of claim 1, wherein the oxide compound comprises (Ba₁₋

x−

ySr_xMg_y)_zTiO<sub>(2+z−

δ

)</sub>F_2δ

wherein

0≦

x≦

1, 0≦

y≦

1, 0≦

(x+y)≦

1, z=0 or 1≦

z≦

2, and 0≦

δ

≦

1.

4. The power transfer system of claim 1, wherein the ceramic powder has a size in the range from about 5 nm to about 50 μ

m.

5. The power transfer system of claim 4, wherein the ceramic powder has a size in the range from about 10 nm to about 100 nm.

6. The power transfer system of claim 1, wherein the resin comprises a material selected from the group consisting of PTFE and an epoxy resin.

7. The power transfer system of claim 6, wherein the dielectric material comprises MgTiO₃ and PTFE.

8. The power transfer system of claim 6, wherein the dielectric material comprises SrTiO₃ and PTFE.

9. The power transfer system of claim 6, wherein the dielectric material comprises TiO₂ and epoxy resin.

10. The power transfer system of claim 6, wherein the dielectric material comprises Ba₁₋

xSr_xTiO<sub>3−

δ</sub>

F_2δ

and PTFE, wherein 0≦

x≦

1, and 0≦

δ

≦

1.

11. The power transfer system of claim 6, wherein the dielectric material comprises MgTiO₃ and epoxy resin.

12. The power transfer system of claim 6, wherein the dielectric material comprises SrTiO₃ and epoxy resin.

13. A power transfer system comprising:

a first coil coupled to a power source;

a second coil coupled to a load; and

a field-focusing element disposed between the first coil and the second coil and comprising a dielectric material, wherein the dielectric material comprises;

an oxide compound comprising titanium; and

a polymer material comprising a resin.

14. A power transfer system comprising:

a first coil coupled to a power source;

a second coil coupled to a load; and

a field-focusing element disposed between the first coil and the second coil and comprising a resonator, wherein the resonator comprises a plurality of layers, comprising a dielectric layer and a metallic layer, configured in a Swiss-roll form, wherein the neighboring dielectric layers are separated by the metallic layer, and the dielectric layer comprises a dielectric material comprising;

an oxide compound comprising titanium; and

a polymer material comprising a resin.

15. The power transfer system of claim 14, wherein the dielectric layer is disposed over the metallic layer.

16. The power transfer system of claim 14, wherein the dielectric layer has a thickness in the range from about 0.01 mm to about 1 mm.

17. The power transfer system of claim 14, wherein the metallic layer has a thickness in the range from about 0.1 mm to 10 mm.

18. A method of forming a power transfer system, comprising:

forming a resonator comprising;

disposing a metallic layer;

blending a ceramic material and polymer material to form a dielectric material;

depositing the dielectric material over the metallic layer to form a dielectric layer;

forming a Swiss-roll structure of metallic layer and dielectric layer; and

curing the Swiss-roll structure to form a monolithic Swiss-roll structure.

19. The method of claim 18, wherein the metallic layer is prepared by disposing metallic powders.

20. The method of claim 18, wherein the metallic layer, and the dielectric layer are cured together to obtain an integrated monolithic structure of density greater than 98% by volume.

21. The method of claim 18, wherein the the swiss-roll is further subjected to a heat-treatment in an inert atmosphere.