TEST APPARATUSES FOR MEASURING ELECTROMAGNETIC INTERFERENCE OF IMAGE SENSOR INTEGRATED CIRCUIT DEVICES

• US 20130193984A1
• Filed: 09/12/2012
• Published: 08/01/2013
• Est. Priority Date: 01/30/2012
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Se-il, LEE, Seung-Bae, LIM, Jung-Man, KIM, Sung-Chul, PARK, Kyung-Won, PARK, Hyun-Jung
• Application Number:
  US13/610,984
• Publication Number:
  US 20130193984A1
• Time in Patent Office: Days
• US Class Current: 324/613
• CPC Class Codes: G01R 29/0814 Field measurements related to measuring influence on or from apparatus, components or humans EMC, EMI and similar testing in general G01R31/001, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
• CPC Class Codes: G01R 31/002 where the device under test is an electronic circuit

Abstract

A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device may include an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions; an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig; an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device.

Claims

1. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:

an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions;

an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig;

an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and

a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device.

2. The test apparatus of claim 1, wherein the EMI test jig comprises:

a circuit board;

a shielding conducting layer that covers an upper face of the circuit board except for a central portion of the upper face;

a connection socket formed in the central portion of the upper face, the image sensor IC device being configured to mount on the connection socket; and

a test driving circuit formed in a lower face of the circuit board, the test driving circuit configured to drive the image sensor IC device when the image sensor IC device is mounted on the connection socket.

3. The test apparatus of claim 2, wherein the test driving circuit is configured to connect to a power supply conducting layer and a ground conducting layer such that the test driving circuit performs independent test operations, and

wherein the power supply conducting layer and the ground conducting layer are formed in the lower face of the circuit board.

4. The test apparatus of claim 2, wherein the test driving circuit is configured to drive the image sensor IC device on at least one of the following test conditions:

battery powered operation after initialization;

full resolution image;

maximum analog gain;

input/output (I/O) port;

serial and parallel interface;

fixed output image (color bar or test pattern);

maximum frame rate;

operating frequency;

typical I/O driving strength;

power supply voltage; and

external clock.

5. The test apparatus of claim 2, further comprising:

an EMI grade evaluation device configured to connect to the spectrum analyzer;

wherein the EMI grade evaluation device includes an EMI grade evaluation algorithm for determining EMI grade for evaluation frequency bandwidths.

6. The test apparatus of claim 5, wherein the evaluation frequency bandwidths include harmonic bandwidths of a fundamental clock frequency of the image sensor IC device, and

wherein the EMI grade evaluation device evaluates which block of a plurality of blocks of the image sensor IC device serves as an EMI source based on amplitudes of the harmonic bandwidths.

7. The test apparatus of claim 5, wherein the evaluation frequency bandwidths include mobile radio-frequency (RF) communication frequency bandwidths, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists and whether the EMI influences a frequency band of a high frequency block adjacent to the image sensor IC device in a mobile phone set when the image sensor IC device is mounted on the mobile phone set.

8. The test apparatus of claim 5, wherein the evaluation frequency bandwidths include wideband frequency bandwidths with 20 MHz spans, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists in each of the wideband frequency bandwidths.

9. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:

an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions;

a connection device connected to a conducting layer provided as a power line of the EMI test jig, the connection device configured to block direct current (DC) and configured to connect externally an EMI that is generated from the image sensor IC device and that is propagated to the conducting layer; and

a spectrum analyzer configured to measure the EMI propagated to the conducting layer.

10. The test apparatus of claim 9, wherein the EMI test jig comprises:

a shielding conducting layer that covers an upper face of a circuit board of the EMI test jig, except a central portion of the upper face;

a connection socket formed in the central portion of the upper face and on which the image sensor IC device is mounted;

a test driving circuit formed in a lower face of the circuit board, the test driving circuit configured to drive the image sensor IC mounted on the connection socket; and

the conducting layer formed in the lower face of the circuit board, the conducting layer configured to serve as the power line for providing power supply voltage to the test driving circuit.

11. The test apparatus of claim 10, wherein the test driving circuit is configured to drive the image sensor IC device on at least one of the following test conditions:

battery powered operation after initialization;

full resolution image;

maximum analog gain;

input/output (I/O) port;

serial and parallel interface;

fixed output image (color bar or test pattern);

maximum frame rate;

operating frequency;

typical I/O driving strength;

power supply voltage; and

external clock.

12. The test apparatus of claim 9, further comprising:

an EMI grade evaluation device configured to connect to the spectrum analyzer;

wherein the EMI grade evaluation device includes an EMI grade evaluation algorithm for determining EMI grades for evaluation frequency bandwidths.

13. The test apparatus of claim 12, wherein the evaluation frequency bandwidths include harmonic bandwidths of a fundamental clock frequency of the image sensor IC device, and

wherein the EMI grade evaluation device is configured to evaluate which block of a plurality of blocks of the image sensor IC device serves as an EMI source based on amplitudes of the harmonic bandwidths.

14. The test apparatus of claim 12, wherein the evaluation frequency bandwidths include mobile radio-frequency (RF) communication frequency bandwidths, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists and whether the EMI influences a frequency band of a high frequency block adjacent to the image sensor IC device in a mobile phone set when the image sensor IC device is mounted on the mobile phone set.

15. The test apparatus of claim 12, wherein the evaluation frequency bandwidths include wideband frequency bandwidths with 20 MHz spans, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists in each of the wideband frequency bandwidths.

16. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:

an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions, the EMI test jig including a connection socket and a shielding conducting layer on a first side of a circuit board, and a test driving circuit, a power supply conducting layer, and a ground conducting layer on a second side of the circuit board; and

a spectrum analyzer configured to evaluate results from the test driving circuit;

wherein the test driving circuit is connected to the power supply conducting layer and the ground conducting layer.

17. The test apparatus of claim 16, further comprising:

an EMI grade evaluation device connected to the spectrum analyzer;

wherein the EMI grade evaluation device includes a grade evaluation algorithm for determining EMI grades for evaluation frequency bandwidths.

18. The test apparatus of claim 17, wherein the evaluation frequency bandwidths include harmonic bandwidths of a fundamental clock frequency of the image sensor IC device, and

wherein the EMI grade evaluation device is configured to evaluate which block of a plurality of blocks of the image sensor IC device serves as an EMI source based on amplitudes of the harmonic bandwidths.

19. The test apparatus of claim 17, wherein the evaluation frequency bandwidths include mobile radio-frequency (RF) communication frequency bandwidths, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists and whether the EMI influences a frequency band of a high frequency block adjacent to the image sensor IC device in a mobile phone set when the image sensor IC device is mounted on the mobile phone set.

20. The test apparatus of claim 17, wherein the evaluation frequency bandwidths include wideband frequency bandwidths with 20 MHz spans, and

wherein the EMI grade evaluation device is configured to evaluate whether the EMI exists in each of the wideband frequency bandwidths.