TEST APPARATUSES FOR MEASURING ELECTROMAGNETIC INTERFERENCE OF IMAGE SENSOR INTEGRATED CIRCUIT DEVICES
First Claim
1. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:
- an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions;
an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig;
an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and
a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device.
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Accused Products
Abstract
A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device may include an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions; an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig; an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device.
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Citations
20 Claims
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1. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:
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an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions; an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig; an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:
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an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions; a connection device connected to a conducting layer provided as a power line of the EMI test jig, the connection device configured to block direct current (DC) and configured to connect externally an EMI that is generated from the image sensor IC device and that is propagated to the conducting layer; and a spectrum analyzer configured to measure the EMI propagated to the conducting layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device, the test apparatus comprising:
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an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions, the EMI test jig including a connection socket and a shielding conducting layer on a first side of a circuit board, and a test driving circuit, a power supply conducting layer, and a ground conducting layer on a second side of the circuit board; and a spectrum analyzer configured to evaluate results from the test driving circuit; wherein the test driving circuit is connected to the power supply conducting layer and the ground conducting layer. - View Dependent Claims (17, 18, 19, 20)
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Specification