MEMS VIBRATION ISOLATION SYSTEM AND METHOD
First Claim
1. A microelectromechanical vibration isolation system, comprising:
- a microelectromechanical structure having a plurality of fin apertures etched therethrough;
a plurality of fins each disposed within a respective one of the plurality of fin apertures and spaced apart from the microelectromechanical structure so as to define a fluid gap therebetween, the fluid gap being configured to provide squeeze film damping of vibrations imparted upon the microelectromechanical structure in at least two dimensions;
a frame surrounding the microelectromechanical structure; and
a plurality of springs each coupled to the microelectromechanical structure and to the frame, the plurality of springs being configured to support the micromechanical structure in relation to the frame.
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Abstract
A microelectromechanical vibration isolation system includes a microelectromechanical structure having a plurality of fin apertures etched therethrough, and a plurality of fins each disposed within a respective one of the plurality of fin apertures and spaced apart from the microelectromechanical structure so as to define a fluid gap therebetween. The fluid gap is configured to provide squeeze film damping of vibrations imparted upon the microelectromechanical structure in at least two dimensions. The system further includes a frame surrounding the microelectromechanical structure, and a plurality of springs each coupled to the microelectromechanical structure and to the frame. The plurality of springs is configured to support the micromechanical structure in relation to the frame.
21 Citations
31 Claims
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1. A microelectromechanical vibration isolation system, comprising:
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a microelectromechanical structure having a plurality of fin apertures etched therethrough; a plurality of fins each disposed within a respective one of the plurality of fin apertures and spaced apart from the microelectromechanical structure so as to define a fluid gap therebetween, the fluid gap being configured to provide squeeze film damping of vibrations imparted upon the microelectromechanical structure in at least two dimensions; a frame surrounding the microelectromechanical structure; and a plurality of springs each coupled to the microelectromechanical structure and to the frame, the plurality of springs being configured to support the micromechanical structure in relation to the frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A microelectromechanical vibration isolation system, comprising:
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a microelectromechanical structure having a plurality of recesses etched therein; a frame surrounding the microelectromechanical structure; means for coupling the microelectromechanical structure to the frame such that the micromechanical structure is supported in relation to the frame; and means for damping vibrations imparted upon the microelectromechanical structure including a plurality of damping structures each disposed within a respective one of the plurality of recesses. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A method of making a vibration isolation apparatus, the method comprising:
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etching a plurality of fin apertures into a substrate wafer to form a first portion of the substrate wafer having a plurality of fin structures disposed within respective ones of the plurality of fin apertures, wherein the plurality of fin apertures form a fluid gap between the plurality of fin structures and a second portion of the substrate wafer. - View Dependent Claims (28, 29, 30, 31)
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Specification