Electric Power Conversion Apparatus
First Claim
1. A power converter, comprising:
- a semiconductor module that comprises a power semiconductor element to convert DC power to AC power;
a capacitor for smoothing the DC power;
a DC-side connecting conductor that transmits the DC power from the capacitor to the semiconductor module;
a passage forming body that is constructed of a thermally conductive member and forms a passage through which coolant flows; and
a case that defines a housing space for housing the semiconductor module and is provided with an opening portion, wherein;
the semiconductor module is disposed at one side of the passage forming body and the capacitor is disposed at another side of the passage forming body, opposite to the semiconductor module via the passage forming body;
the passage forming body is provided with an opening that communicates with the passage at the side of the passage forming body where the semiconductor module is disposed and a through hole that connects between a space in which the semiconductor module is disposed and a space in which the capacitor is disposed;
the semiconductor module is provided with a heat transfer plate on which the power semiconductor element is mounted via an insulating substrate;
the heat transfer plate closes the opening so as to directly contact with the coolant;
the opening portion of the case is closed by the passage forming body in a state in which the semiconductor module is housed in the housing space of the case; and
the DC-side connecting conductor extends through the through hole to electrically connect the capacitor with the semiconductor module.
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Accused Products
Abstract
An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
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Citations
12 Claims
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1. A power converter, comprising:
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a semiconductor module that comprises a power semiconductor element to convert DC power to AC power; a capacitor for smoothing the DC power; a DC-side connecting conductor that transmits the DC power from the capacitor to the semiconductor module; a passage forming body that is constructed of a thermally conductive member and forms a passage through which coolant flows; and a case that defines a housing space for housing the semiconductor module and is provided with an opening portion, wherein; the semiconductor module is disposed at one side of the passage forming body and the capacitor is disposed at another side of the passage forming body, opposite to the semiconductor module via the passage forming body; the passage forming body is provided with an opening that communicates with the passage at the side of the passage forming body where the semiconductor module is disposed and a through hole that connects between a space in which the semiconductor module is disposed and a space in which the capacitor is disposed; the semiconductor module is provided with a heat transfer plate on which the power semiconductor element is mounted via an insulating substrate; the heat transfer plate closes the opening so as to directly contact with the coolant; the opening portion of the case is closed by the passage forming body in a state in which the semiconductor module is housed in the housing space of the case; and the DC-side connecting conductor extends through the through hole to electrically connect the capacitor with the semiconductor module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electric power conversion apparatus, comprising:
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a semiconductor module that comprises a plurality of power semiconductor devices for converting a direct current to an alternate current; and a channel forming body configured to form a channel through which a refrigerant for cooling the semiconductor module flows, wherein; the semiconductor module comprises a first metal heat dissipation member and a second metal heat dissipation member that are thermally in contact with the refrigerant and are disposed so as to face each other and to sandwich the plurality of power semiconductor devices, and a positive terminal and a negative terminal for conducting the direct current; the plurality of power semiconductor devices include an upper aim IGBT that constitutes an upper arm circuit of an inverter circuit, an upper arm diode that is electrically connected in parallel with the upper arm IGBT, a lower arm IGBT that constitutes a lower arm circuit of the inverter circuit, and a lower arm diode that is electrically connected in parallel with the lower arm IGBT; the upper arm IGBT and the upper arm diode are sandwiched by a first conducting plate that is electrically connected to a collector of the upper arm IGBT and a cathode of the upper arm diode and a second conducting plate that is electrically connected to an emitter of the upper arm IGBT and an anode of the upper arm diode; the lower arm IGBT and the lower arm diode are sandwiched by a third conducting plate that is electrically connected to a collector of the lower arm IGBT and a cathode of the lower arm diode and a fourth conducting plate that is electrically connected to an emitter of the lower arm IGBT and an anode of the lower arm diode; a projected part obtained by projecting the first heat dissipation member in a direction perpendicular to a heat dissipation surface of the first heat dissipation member is formed in a rectangle that includes a first side, a second side facing the first side, a third side connecting the first side and the second side, and a fourth side facing the third side; the positive terminal and the negative terminal project out from the third side; the upper atm IGBT and the upper arm diode are disposed side by side along the first side so that the upper arm IGBT is arranged closer to the third side than the upper aim diode is; the lower arm IGBT and the lower arm diode are disposed side by side along the second side so that the lower arm IGBT is arranged closer to the third side than the lower arm diode is; and a connecting portion that electrically connects the second conducting plate and the third conducting plate is disposed at a position closer to a row in which the upper arm diode and the lower arm diode are arranged than to a row in which the upper arm IGBT and the lower arm IGBT are arranged. - View Dependent Claims (10, 11, 12)
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Specification