MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES
First Claim
1. A method of fabricating transferable semiconductor devices, the method comprising:
- providing a release layer comprising indium aluminum phosphide on a substrate;
providing a support layer on the release layer, the support layer and the substrate comprising respective materials such that the release layer has an etching selectivity relative to the support layer and the substrate;
providing at least one device layer on the support layer; and
selectively etching the release layer without substantially etching the support layer and the substrate.
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Accused Products
Abstract
A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
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Citations
49 Claims
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1. A method of fabricating transferable semiconductor devices, the method comprising:
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providing a release layer comprising indium aluminum phosphide on a substrate; providing a support layer on the release layer, the support layer and the substrate comprising respective materials such that the release layer has an etching selectivity relative to the support layer and the substrate; providing at least one device layer on the support layer; and selectively etching the release layer without substantially etching the support layer and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21-38. -38. (canceled)
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39. A process of releasing printable devices from a gallium arsenide substrate, comprising:
selectively laterally etching a release layer of indium aluminum phosphide in a mixture of hydrochloric acid and ethanol. - View Dependent Claims (40)
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41. A method of preparing a releasable printable device, comprising:
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epitaxially growing on a gallium arsenide substrate an indium aluminum phosphide release layer, an arsenide-based layer adjacent to the release layer, and device layers, thereby forming an epi-stack; partially or fully forming functional devices on the epi-stack and exposing some portion of the release layer by microfabrication techniques; and selectively laterally etching the release layer in a mixture of hydrochloric acid and ethanol, thereby releasing the devices. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49)
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Specification