BACKING ELEMENT OF ULTRASONIC PROBE, BACKING LAYER OF ULTRASONIC PROBE, AND MANUFACTURING METHOD THEREOF

• US 20130197368A1
• Filed: 01/31/2013
• Published: 08/01/2013
• Est. Priority Date: 01/31/2012
• Status: Active Grant

• Current Assignee: Samsung Medison Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Medison Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: JIN, Gil-ju
• Granted Patent: US 10,390,793 B2
• Time in Patent Office: Days
• US Class Current: 600/459
• CPC Class Codes: A61B 8/13 Tomography A61B8/10, A61B8/12 take precedence; tomography for radiation diagnosis A61B6/02
• CPC Class Codes: A61B 8/4444 related to the probe
• CPC Class Codes: A61B 8/4488 the transducer being a phased array
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: B06B 1/0681 and a damping structure
• CPC Class Codes: G10K 11/002 Devices for damping, suppressing, obstructing or conducting sound in acoustic devices G10K1/06 - G10K1/10 take precedence; for electro-mechanical transducers for communication H04R3/002
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A backing element of a ultrasonic probe, a backing layer of a ultrasonic probe, and a manufacturing method thereof, the backing layer formed by arranging a plurality of members each having a shape of a polygonal column in a one-dimensional manner or in a two-dimensional manner while each of the plurality of members is provided with a conductive trace formed at one side surface thereof, thereby electrically connecting an ultrasonic transducer array, which is being acoustically connected to the backing layer, in a further simple and definite manner.

Claims

1. A backing element of an ultrasonic probe, comprising:

a member having a shape of a polygonal column acoustically connected to an ultrasonic transducer element; and

a conductive trace formed at one side surface of the member and electrically connected to the ultrasonic transducer element.

2. The backing element of claim 1, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

3. A backing element of an ultrasonic probe, the backing element comprising:

a member having a shape of a polygonal column acoustically connected to an ultrasonic transducer element; and

conductive traces formed at more than two side surfaces of the member and electrically connected to the ultrasonic transducer element.

4. The backing element of claim 3, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

5. A backing layer of an ultrasonic probe, the backing layer comprising:

a plurality of members each having a shape of a polygonal column arranged in a one-dimensional manner or in a two-dimensional manner, the plurality of members each provided at one side surface thereof with a conductive trace

wherein the plurality of members is acoustically connected to a ultrasonic transducer array, and each of the conductive traces formed at each of the plurality of members is electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array.

6. The backing layer of claim 5, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer array.

7. The backing layer of claim 5, wherein:

the plurality of members is adhesively attached to each other by using same material as material of the member, and is arranged in a one-dimensional manner or in a two-dimensional manner.

8. A backing layer of an ultrasonic probe, the backing layer comprising:

a plurality of members each having a shape of a polygonal column arranged in a one-dimensional manner or in a two-dimensional manner, the plurality of members each provided at more than two side surfaces thereof with conductive traces formed,

wherein the plurality of members is acoustically connected to a ultrasonic transducer array, and each of the conductive traces formed at each of the plurality of members is electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array.

9. The backing layer of claim 8, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer array.

10. The backing layer of claim 8, wherein:

the plurality of members is adhesively attached to each other by using same material as material of the member, and is arranged in a one-dimensional manner or in a two-dimensional manner.

11. A method of manufacturing a backing element of an ultrasonic probe, the method comprising:

generating a member having a shape of a polygonal column acoustically connected to an ultrasonic transducer element; and

forming a conductive trace at one side surface of the member, the conductive trace being electrically connected to the ultrasonic transducer element.

12. The method of claim 11, further comprising:

forming an electrode layer at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

13. A method of manufacturing a backing element of an ultrasonic probe, the method comprising:

generating a member having a shape of a polygonal column acoustically connected to an ultrasonic transducer element; and

forming conductive traces at more than two side surfaces of the member, the conductive traces each electrically connected to the ultrasonic transducer element.

14. The method of claim 13, further comprising:

forming an electrode layer at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

15. A method of manufacturing a backing layer of an ultrasonic probe, the method comprising:

generating a plurality of members each having a shape of a polygonal column acoustically connected to an ultrasonic transducer array;

forming a conductive trace at one side surface of each of the plurality of members, each of the conductive traces being electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array; and

arranging the plurality of members each provided with the conductive trace formed, in a one-dimensional manner or in a two-dimensional manner.

16. The method of claim 15, further comprising:

forming an electrode layer at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer array.

17. The method of claim 15, wherein:

the arranging of the plurality of members in a one-dimensional manner or in a two-dimensional manner comprises adhesively attaching the plurality of members each other by using same material as material of the member.

18. A method of manufacturing a backing layer of an ultrasonic probe, the method comprising:

generating a plurality of member each having a shape of a polygonal column acoustically connected to an ultrasonic transducer array;

forming conductive traces at more than two side surfaces of each of the plurality of members, each of the conductive traces electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array; and

arranging the plurality of members each provided with the conductive trace formed thereof, in a one-dimensional manner or in a two-dimensional manner.

19. The method of claim 18, further comprising:

forming an electrode layer at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer array.

20. The method of claim 18, wherein:

the arranging of the plurality of members in a one-dimensional manner or in a two-dimensional manner comprises adhesively attaching the plurality of members each other by using same material as material of the member.

21. A backing element of an ultrasonic probe, the backing element comprising:

a member having a shape of a hexagonal column acoustically connected to an ultrasonic transducer element; and

a conductive trace formed at one side surface of the member and electrically connected to the ultrasonic transducer element.

22. The backing element of claim 21, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

23. A backing element of an ultrasonic probe, the backing element comprising:

a member having a shape of a hexagonal column acoustically connected to an ultrasonic transducer element; and

conductive traces formed at more than two side surfaces of the member and electrically connected to the ultrasonic transducer element.

24. The backing element of claim 23, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

25. A backing layer of an ultrasonic probe, the backing layer comprising:

a plurality of members each having a shape of a hexagonal column arranged in a one-dimensional manner or in a two-dimensional manner, the plurality of members each provided at more than two side surfaces thereof with conductive traces,

wherein the plurality of members is acoustically connected to an ultrasonic transducer array, and each of the conductive traces formed at each of the plurality of members is electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array.

26. A backing element of an ultrasonic probe, the backing layer comprising:

a member having a shape of a triangular column acoustically connected to an ultrasonic transducer element; and

a conductive trace formed at one side surface of the member and electrically connected to the ultrasonic transducer element.

27. The backing element of claim 26, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, at least one surface being acoustically connected to the ultrasonic transducer element.

28. A backing element of an ultrasonic probe, the backing element comprising:

a member having a shape of a triangular column acoustically connected to an ultrasonic transducer element; and

conductive traces formed at more than two side surfaces of the member and electrically connected to the ultrasonic transducer element.

29. The backing element of claim 28, wherein:

an electrode layer is formed at an upper surface or a lower surface of the member, the upper surface or the lower surface being acoustically connected to the ultrasonic transducer element.

30. A backing layer of an ultrasonic probe, the backing layer comprising:

a plurality of members each having a shape of a triangular column arranged in a one-dimensional manner or in a two-dimensional manner, the plurality of member each provided at more than two side surfaces thereof with conductive traces,

wherein the plurality of members is acoustically connected to an ultrasonic transducer array, and each of the conductive trace formed at each of the plurality of members is electrically connected to one of a plurality of ultrasonic transducer elements that composes the ultrasonic transducer array.