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HEAT DISPERSION FOR IMPLANTABLE MEDICAL DEVICES

  • US 20130197608A1
  • Filed: 01/27/2012
  • Published: 08/01/2013
  • Est. Priority Date: 01/27/2012
  • Status: Active Grant
First Claim
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1. An implantable medical device, comprising:

  • electrical circuitry;

    a housing forming an inner chamber that is adapted for receiving at least a portion of the electrical circuitry; and

    a thermally conductive material that is specifically configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component, wherein the thermally conductive material is a discrete component or treatment separate from the electrical circuitry and the housing.

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