HAIL RESISTANT PHOTOVOLTAIC MODULES
First Claim
Patent Images
1. A photovoltaic module comprising a front sheet, a front encapsulant layer, at least one photoactive cell having a frontface and a backface, and a backing sheet, wherein the backface of the photoactive cell is in direct contact with the backing sheet and the backing sheet has a Young'"'"'s modulus of from 15 to 200 GPa when measured according to standard ISO 527 at a temperature of 23°
- C. at a relative humidity of 50%.
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Accused Products
Abstract
A photovoltaic module comprising a front sheet, a front encapsulant layer, at least one photoactive cell having a frontface and a backface, and a backing sheet, wherein the backface of the photoactive cell is in direct contact with the backing sheet.
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Citations
6 Claims
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1. A photovoltaic module comprising a front sheet, a front encapsulant layer, at least one photoactive cell having a frontface and a backface, and a backing sheet, wherein the backface of the photoactive cell is in direct contact with the backing sheet and the backing sheet has a Young'"'"'s modulus of from 15 to 200 GPa when measured according to standard ISO 527 at a temperature of 23°
- C. at a relative humidity of 50%.
- View Dependent Claims (2, 3, 4, 5)
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6. A process for the manufacture of a photovoltaic module comprising the steps of:
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(a) assembling a stack by i. placing at least one photoactive cell on a backing sheet having a Young'"'"'s modulus of from 15 to 200 GPa when measured according to standard ISO 527 at a temperature of 23°
C. at a relative humidity of 50%, such that the at least one photoactive cell and the backing sheet are in direct contact to each other,ii. placing a sheet of front encapsulant on top of the at least one photoactive cell, and iii. placing a front sheet on top of the front encapsulant sheet, (b) consolidating the so assembled stack in a laminating device by i. heating the stack to a temperature of 100 to 180°
C.,ii. subjecting the heated stack to a mechanical pressure in a direction perpendicular to the plane of the stack by decreasing the ambient pressure in the laminating device to 300 to 1200 mbar, and iii. cooling the stack to ambient temperature and releasing the mechanical pressure by reestablishing atmospheric pressure in the laminating device.
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Specification