Connecting Conductive Layers Using In-Mould Lamination And Decoration
First Claim
1. A touch sensor comprising:
- a first substrate comprising a plurality of electrodes formed on a surface of the first substrate;
a second substrate comprising a plurality of electrodes formed on a surface of the second substrate, the surface of the second substrate comprising the plurality of electrodes opposing the surface of the first substrate comprising the plurality of electrodes, respective portions of the first and second substrates spaced being apart from each other by a dielectric material disposed between the respective portions of the first and second substrates, the plurality of electrodes forming of the first substrate each configured to form a capacitively coupled node with at least one of the plurality of electrodes of the second substrate, each capacitively coupled node configured to sense touch of an object, a portion of the second substrate deformed by compression such that a conductive pad on the second substrate and a conductive pad on the first substrate are connected and electrically coupled to each other;
a solidified resin that had been injected in a liquid form on the second substrate, the conductive pad on the second substrate being compressed against the conductive pad on the first substrate by the injection of the resin while in the liquid form.
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0 Petitions
Accused Products
Abstract
In one embodiment, a method for forming a touch sensor is provided. The method includes forming a plurality of electrodes on a first substrate. The plurality of electrodes are configured to form a plurality of capacitive nodes. Each capacitive node is configured to sense touch of an object proximate a touch sensing area of the substrate. The method further includes compressing together a plurality of conductive pads at least in part by applying a resin in liquid form to a first substrate, the resin being applied under pressure. A first one of the plurality of conductive pads had been formed on the first substrate. A second one of the plurality of conductive pads had been formed on a second substrate.
21 Citations
20 Claims
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1. A touch sensor comprising:
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a first substrate comprising a plurality of electrodes formed on a surface of the first substrate; a second substrate comprising a plurality of electrodes formed on a surface of the second substrate, the surface of the second substrate comprising the plurality of electrodes opposing the surface of the first substrate comprising the plurality of electrodes, respective portions of the first and second substrates spaced being apart from each other by a dielectric material disposed between the respective portions of the first and second substrates, the plurality of electrodes forming of the first substrate each configured to form a capacitively coupled node with at least one of the plurality of electrodes of the second substrate, each capacitively coupled node configured to sense touch of an object, a portion of the second substrate deformed by compression such that a conductive pad on the second substrate and a conductive pad on the first substrate are connected and electrically coupled to each other; a solidified resin that had been injected in a liquid form on the second substrate, the conductive pad on the second substrate being compressed against the conductive pad on the first substrate by the injection of the resin while in the liquid form. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A touch sensor comprising:
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a substrate comprising a plurality of electrodes formed thereon, the plurality of electrodes configured to form a plurality of capacitive nodes, each capacitive node configured to sense touch of an object proximate a touch sensing area of the substrate; and an in-mould decoration layer disposed outwardly from the substrate, the in-mould decoration layer comprising; a ground ring formed on an inner surface of the in-mould decoration layer, the inner surface facing the substrate, the ground ring forming a continuous perimeter around a transparent volume of the in-mould decoration layer disposed outwardly from the touch sensing area of the substrate, the ground ring being electrically coupled to a ground pad formed on the substrate; and an optically opaque layer formed on an outer surface of the in-mould decoration layer, the optically opaque layer disposed outwardly from the ground ring such that the optically opaque layer masks the ground ring, the outer surface of the in-mould decoration layer being opposite from, and disposed outwardly from, the inner surface of the in-mould decoration layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for forming a touch sensor, the method comprising:
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forming a plurality of electrodes on a first substrate, the plurality of electrodes configured to form a plurality of capacitive nodes, each capacitive node configured to sense touch of an object proximate a touch sensing area of the substrate; and compressing together a plurality of conductive pads at least in part by applying a resin in liquid form to a first substrate, the resin being applied under pressure, a first one of the plurality of conductive pads having been formed on the first substrate, a second one of the plurality of conductive pads having been formed on a second substrate. - View Dependent Claims (19, 20)
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Specification