LIGHT-EMITTING MODULE

• US 20130200402A1
• Filed: 01/29/2013
• Published: 08/08/2013
• Est. Priority Date: 02/03/2012
• Status: Abandoned Application

• Current Assignee: Shu-Mei Ku
• Original Assignee: Shu-Mei Ku
• Inventors: YANG, Cheng-Tao
• Application Number:
  US13/752,937
• Publication Number:
  US 20130200402A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A light-emitting module includes a plate substrate, two circuit substrates, at least one LED chip, a plurality of wires and a molding component. The plate substrate includes a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate. The two circuit substrates directly stack on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to the chip carriers penetrating therethrough and the upper surface of each chip carrier is at a higher or the same horizontal of the surface of the corresponding circuit substrate. The LED chip is arranged on each chip carrier. Each LED chip and the corresponding circuit substrates are electrically connected with a plurality of wires. Each of LED chips, each of chip carriers, wires and a portion of the circuit substrates are covered with the molding component.

Claims

1. A light-emitting module, including

a plate substrate including a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate, wherein the plate substrate is made of a high thermal conductive material and the plurality of chip carriers are arranged at a peripheral region of the plate substrate;

two circuit substrates directly stacking on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to each of the chip carriers penetrating therethrough and the upper surface of each of the chip carriers are at a higher or the same horizontal in comparison to the surface of the corresponding circuit substrate;

at least one LED chip arranged on each of the chip carriers;

a plurality of wires electrically connecting each of the LED chips and the corresponding circuit substrates; and

a molding component covering each of the LED chips, each of the chip carriers, wires and a portion of the circuit substrates.

2. The light-emitting module as claimed in claim 1, wherein a heat dissipation joint part is arranged at one side of the plate substrate.

3. The light-emitting module as claimed in claim 2, further including:

a heat sink, wherein the plate substrate is vertically joined to the heat sink through the heat dissipation joint part.

4. The light-emitting module as claimed in claim 1, wherein a heat dissipation joint part is arranged at a surface of the plate substrate.

5. The light-emitting module as claimed in claim 4, further including:

a heat sink, wherein the plate substrate is horizontally joined to the heat sink through the heat dissipation joint part.

6. The light-emitting module as claimed in claim 1, wherein the plurality of the chip carriers are arranged in a center region of the plate substrate.

7. The light-emitting module as claimed in claim 1, further including:

a controller chip configured on a controller chip carrier and electrically connected to the circuit substrate, wherein the controller chip carrier is at a higher or the same horizontal in comparison to the upper surface of the plate substrate.

8. A light-emitting module, including

a plate substrate, wherein the plate substrate is made of a high thermal conductive material;

a plurality of chip carriers are arranged at a peripheral region of the plate substrate; and

a heat dissipation joint part is arranged at one side or one surface of the plate substrate;

two circuit substrates directly stacking on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to each of the chip carriers penetrating therethrough;

at least one LED chip arranged on each of the chip carriers;

a plurality of wires electrically connecting each of the LED chips and the corresponding circuit substrates;

a molding component covering each of the LED chips, chip carriers, wires and a portion of the circuit substrates; and

a heat sink, wherein the plate substrate is vertically or horizontally joined to the heat sink through the heat dissipation joint part.

9. The light-emitting module as claimed in claim 8, wherein some of the plurality of the chip carriers are arranged in a center region of the plate substrate.

10. The light-emitting module as claimed in claim 8, further including:

a controller chip configured on a controller chip carrier and electrically connected to the circuit substrates, wherein the controller chip carrier is at the same or a higher horizontal in comparison to the upper surface of the plate substrate.