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LIGHT-EMITTING DIODE DEVICE

  • US 20130200414A1
  • Filed: 01/29/2013
  • Published: 08/08/2013
  • Est. Priority Date: 10/26/2011
  • Status: Abandoned Application
First Claim
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1. An encapsulated light-emitting diode device, comprising:

  • a circuit carrier, comprising a surface; and

    a light-emitting device, comprising;

    a transparent substrate, comprising a first surface and a second surface;

    a light-emitting diode chip located on the first surface of the transparent substrate; and

    a first transparent glue covering the light-emitting diode chip and formed on the first surface;

    wherein the first surface and the surface comprise an included angle larger than zero;

    wherein the first transparent glue has a substantially circular projection on the first surface and the light-emitting diode chip is substantially located at the geometry center of the circular projection.

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