LIGHT-EMITTING DIODE DEVICE

• US 20130200414A1
• Filed: 01/29/2013
• Published: 08/08/2013
• Est. Priority Date: 10/26/2011
• Status: Abandoned Application

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: Hsu, Chia-Liang, Wu, Han-Min, Huang, Chien-Fu, Hsu, Tzu-Chieh, Hsieh, Min-Hsun, Hsu, Ye-Ming
• Application Number:
  US13/752,423
• Publication Number:
  US 20130200414A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: G02B 6/0025 Diffusing sheet or layer; Prismatic sheet or layer
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; wherein the first surface and the surface comprise an included angle larger than zero; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

Claims

1. An encapsulated light-emitting diode device, comprising:

a circuit carrier, comprising a surface; and

a light-emitting device, comprising;

a transparent substrate, comprising a first surface and a second surface;

a light-emitting diode chip located on the first surface of the transparent substrate; and

a first transparent glue covering the light-emitting diode chip and formed on the first surface;

wherein the first surface and the surface comprise an included angle larger than zero;

wherein the first transparent glue has a substantially circular projection on the first surface and the light-emitting diode chip is substantially located at the geometry center of the circular projection.

2. The encapsulated light-emitting device as claimed in claim 1, wherein the included angle is between 45 degrees to 135 degrees.

3. The encapsulated light-emitting device as claimed in claim 1, further comprising a second transparent glue formed on the second surface corresponding to the first transparent glue.

4. The encapsulated light-emitting device as claimed in claim 1, further comprising a fixing glue forming on the first surface and surrounding the periphery of the first transparent glue.

5. The encapsulated light-emitting device as claimed in claim 4, wherein the fixing glue is a reflective white glue.

6. The encapsulated light-emitting device as claimed in claim 4, wherein the circuit carrier is a printed circuit board (PCB), a flexible circuit board (FCB), a ceramic substrate, or a composite substrate.

7. The encapsulated light-emitting device as claimed in claim 1, further comprising a phosphor layer covering the light-emitting diode chip.

8. The encapsulated light-emitting device as claimed in claim 1, wherein the first transparent glue has phosphor particles therein or thereon.

9. The encapsulated light-emitting device as claimed in claim 1, further comprising an adhesive layer adhering the transparent substrate to the platform.

10. The encapsulated light-emitting device as claimed in claim 1, wherein the material of the first transparent glue comprises polyimide, BCB, PFCB, SU8, epoxy, Acrylic Resin, COC, PMMA, PET, PC, polyetherimide, fluorocarbon polymer, SOG, or other transparent organic material.

11. The encapsulated light-emitting device as claimed in claim 1, the light-emitting diode chip further comprises a front light extraction surface substantially perpendicular to the surface.