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SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

  • US 20130200534A1
  • Filed: 01/24/2013
  • Published: 08/08/2013
  • Est. Priority Date: 02/07/2012
  • Status: Active Grant
First Claim
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1. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed, comprising:

  • a support wafer; and

    an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.

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