SENSOR SELF-DIAGNOSTICS USING MULTIPLE SIGNAL PATHS
First Claim
1. A monolithic integrated circuit sensor system comprising:
- a first sensor device configured to sense a physical characteristic and being coupled to a first signal path comprising a first digital signal processor (DSP) for a first sensor signal on a semiconductor chip, the first DSP providing a first output signal; and
a second sensor device configured to sense the same physical characteristic as the first second device and being coupled to a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path and comprising a second DSP, the second DSP providing a second output signalwherein a comparison of the first output signal and the second output signal can detect an error in the sensor system.
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Accused Products
Abstract
Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.
54 Citations
33 Claims
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1. A monolithic integrated circuit sensor system comprising:
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a first sensor device configured to sense a physical characteristic and being coupled to a first signal path comprising a first digital signal processor (DSP) for a first sensor signal on a semiconductor chip, the first DSP providing a first output signal; and a second sensor device configured to sense the same physical characteristic as the first second device and being coupled to a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path and comprising a second DSP, the second DSP providing a second output signal wherein a comparison of the first output signal and the second output signal can detect an error in the sensor system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 23, 24)
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21. A method of comparing signals in a monolithic integrated circuit sensor system comprising:
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implementing, on a single semiconductor chip, a main signal path comprising a main sensor and a first digital signal processor (DSP); implementing, on the single semiconductor chip, a secondary signal path comprising a secondary sensor and a second DSP, the main and secondary sensors being responsive to the same physical characteristic, the secondary signal path being different from the main signal path, and the second DSP being different from the first DSP by at least one of an architecture or a function; and comparing an output signal of the first DSP with an output signal of the second DSP. - View Dependent Claims (22, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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Specification