ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

• US 20130200972A1
• Filed: 08/03/2012
• Published: 08/08/2013
• Est. Priority Date: 08/25/2011
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: WADA, Koichiro, KUWAHARA, Masashi, NAKADA, Yoshinari, KASUYA, Yuichi, TAKAHASHI, Masanori, KUMAHORA, Tetsuo
• Granted Patent: US 8,717,135 B2
• Time in Patent Office: Days
• US Class Current: 336/90
• CPC Class Codes: H01F 1/33 mixtures of metallic and non-metallic particles; metallic particles having oxide skin
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 27/02 Casings
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

An electronic component has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains containing iron (Fe), silicate (Si) and chromium (Cr), a coil conductive wire wound around the core member, a pair of terminal electrodes connected to ends of the coil conductive wire, and an outer sheath resin part covering the wound coil conductive wire and constituted by a magnetic powder-containing resin; wherein there is an area where only the resin material in the magnetic powder-containing resin is permeated from the surface of the core member to a specified depth.

Claims

1. An electronic component characterized by comprising:

a base material constituted by an assembly of soft magnetic alloy grains;

a sheathed conductive wire wound around the base material; and

an outer sheath resin part constituted by a resin material containing a filler and which covers an outer periphery of the sheathed conductive wire;

wherein the resin material is permeated into the base material from an interface of the base material in contact with the outer sheath resin part.

2. An electronic component according to claim 1, characterized in that the resin material is permeated into the base material from the interface to a depth of 10 to 30 μ

m.

3. An electronic component according to claim 1, characterized in that the resin material constituting the outer sheath resin part contains the filler by 50 percent by volume or more.

4. An electronic component according to claim 1, characterized in that the base material has a water absorption coefficient of 1.0% or more and a void ratio of 10 to 25%.

5. An electronic component according to claim 1, characterized in that the base material is constituted by the soft magnetic alloy grains containing iron, silicate and an element that oxidizes more easily than iron, each soft magnetic alloy grain has an oxidized layer formed on its surface as a result of oxidization of the soft magnetic alloy grain, the oxidized layer contains the element that oxidizes more easily than iron by an amount greater than does the soft magnetic alloy grain, and the grains are bonded together via the oxidized layer.

6. An electronic component according to claim 5, characterized in that the element that oxidizes more easily than iron is chromium and the soft magnetic alloy contains chromium by at least 2 to 15 percent by weight.

7. An electronic component according to claim 1, characterized by comprising:

the base material having a pillar-shaped core and a pair of flange parts provided on both sides of the core;

the sheathed conductive wire wound around the core of the base material;

a pair of terminal electrodes provided on outer surfaces of the flange parts and connected to both ends of the sheathed conductive wire; and

the outer sheath resin part provided between the pair of flange parts in a manner covering an outer periphery of the sheathed conductive wire;

wherein the resin material is permeated at least through surfaces contacted by the outer sheath resin part and facing the pair of flange parts.

8. A method of manufacturing an electronic component characterized by comprising:

a step of winding a sheathed conductive wire around a base material constituted by an assembly of soft magnetic alloy grains;

a step of applying a resin material containing a filler by a first content ratio onto a surface of the base material in a manner covering an outer periphery of the sheathed conductive wire;

a step of permeating the resin material from an interface contacted by the outer sheath resin part into the base material to a specified depth; and

a step of drying and curing the resin material to form an outer sheath resin part constituted by the resin material whose filler content ratio has been changed to a second content ratio which is higher than the first content ratio.

9. A method of manufacturing an electronic component according to claim 8, characterized in that, in the step to permeate the resin material into the base material, the resin material is permeated from the interface into the base material to a depth of 10 to 30 μ

m.

10. A method of manufacturing an electronic component according to claim 8, characterized in that, in the step of applying the resin material, the first content ratio of the filler in the resin material is 40 percent by volume or more.

11. A method of manufacturing an electronic component according to claim 8, characterized in that the base material has a water absorption coefficient of 1.0% or more and a void ratio of 10 to 25%.

12. A method of manufacturing an electronic component according to claim 8, characterized in that the base material is constituted by soft magnetic alloy grains containing iron, silicate, and an element that oxidizes more easily than iron, each soft magnetic alloy grain has an oxidized layer formed on its surface as a result of oxidization of the soft magnetic alloy grain, the oxidized layer contains the element that oxidizes more easily than iron by an amount greater than does the soft magnetic alloy grain, and the grains are bonded together via the oxidized layer.

13. A method of manufacturing an electronic component according to claim 12, characterized in that the element that oxidizes more easily than iron is chromium and the soft magnetic alloy contains chromium by at least 2 to 15 percent by weight.