Method for Removal of Heterocyclic Sulfur using Metallic Copper

• US 20130202511A1
• Filed: 02/06/2012
• Published: 08/08/2013
• Est. Priority Date: 02/06/2012
• Status: Abandoned Application

• Current Assignee: UOP Llc (Honeywell International Inc.)
• Original Assignee: UOP Llc (Honeywell International Inc.)
• Inventors: Kanazirev, Vladislav I., Gorawara, Jayant K.
• Application Number:
  US13/367,174
• Publication Number:
  US 20130202511A1
• Time in Patent Office: Days
• US Class Current: 423/230
• CPC Class Codes: B01D 2253/1122 Metals
• CPC Class Codes: B01D 2253/1124 Metal oxides
• CPC Class Codes: B01D 2255/20761 Copper
• CPC Class Codes: B01D 2257/304 Hydrogen sulfide
• CPC Class Codes: B01D 2257/306 Organic sulfur compounds, e.g. mercaptans
• CPC Class Codes: B01D 2257/308 Carbonoxysulfide COS
• CPC Class Codes: B01D 53/02 by adsorption, e.g. preparative gas chromatography solid sorbent compositions B01J20/00, preparation of inorganic compounds or elements C01
• CPC Class Codes: B01D 53/48 Sulfur compounds
• CPC Class Codes: B01J 20/0237 Compounds of Cu
• CPC Class Codes: B01J 20/0277 Carbonates of compounds other than those provided for in B01J20/043
• CPC Class Codes: B01J 20/046 containing halogens, e.g. halides
• CPC Class Codes: B01J 20/06 comprising oxides or hydroxides of metals not provided for in group B01J20/04
• CPC Class Codes: B01J 20/28004 Sorbent size or size distribution, e.g. particle size
• CPC Class Codes: B01J 20/3078 Thermal treatment, e.g. calcining or pyrolizing
• CPC Class Codes: B01J 20/3204 Inorganic carriers, supports or substrates
• CPC Class Codes: B01J 20/3236 containing metal, other than zeolites, e.g. oxides, hydroxides, sulphides or salts
• CPC Class Codes: C10G 2300/202 Heteroatoms content, i.e. S, N, O, P
• CPC Class Codes: C10G 25/003 Specific sorbent material, not covered by C10G25/02 or C10G25/03
• CPC Class Codes: C10L 3/104 Carbon dioxide

Abstract

A method of removing mercaptans, heterocyclic sulfur compounds, and/or COS from a fluid stream comprising contacting the fluid stream with a sorbent comprising a mixture of Cu₂O and metallic copper.

Claims

1. A method of removing from a fluid stream at least one impurity selected from the group consisting of H₂S, a mercaptan, a heterocyclic sulfur compound, and COS, comprising contacting said fluid stream with a sorbent comprising a mixture of Cu₂O and metallic copper.

2. The method of claim 1, wherein said sorbent comprises no CuO.

3. The method of claim 1, wherein said sorbent further comprises at least one halide salt.

4. The method of claim 3, wherein said at least one halide salt comprises a chloride and said chloride comprises from about 0.05 to about 2.5 mass percent of said sorbent.

5. The method of claim 3, wherein said at least one halide salt comprises a chloride and said chloride comprises from about 0.3 mass percent to about 1.2 mass percent of said sorbent.

6. The method of claim 1 wherein the mixture of Cu₂O and metallic copper is made by reducing CuO at a temperature between about 100°

C. about 200°

C.

7. The method of claim 6 wherein the CuO is reduced with a hydrocarbon at a temperature between about 120 °

C. and about 190°

C.

8. The method of claim 1, wherein the impurity comprises a mercaptan, the method further comprising forming no disulfide compounds.

9. The method of claim 1, wherein the impurity comprises a heterocyclic compound comprising sulfur, the method further comprising forming no disulfide compounds.

10. The method of claim 1, wherein said sorbet further comprises a support material.

11. The method of claim 10, wherein said support material is porous.

12. The method of claim 11, wherein said support material comprises alumina.

13. The method of claim 1, wherein said sorbet comprises a copper content of between about 5 mass percent and 85 mass percent, calculated as CuO on a volatile-free basis.

14. The method of claim 13, wherein said sorbet comprises a copper content of between about 30 mass percent and 60 mass percent, calculated as CuO on a volatile-free basis.

15. The method of claim 14, wherein the mass ratio of Cu to Cu₂O expressed as percent CuO on a volatile free basis is ¼

.

16. The method of claim 1, wherein said sorbent has a diameter (or a maximum width) of between about 1 mm to about 10 mm.

17. The method of claim 16, wherein said sorbent has a diameter (or a maximum width) of between about 1.5 mm to 3 mm.

18. The method of claim 1, wherein the mixture of Cu₂O and metallic copper is formed by reducing CuO with a gaseous reduction agent at temperatures below 250°

C.

19. The method of claim 18, wherein the gaseous reduction agent comprises at least one of H₂, CO, CH₄, or a combination thereof.