LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE
First Claim
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1. A low application temperature hot melt adhesive comprising:
- (a) at least one styrenic block copolymer which has a melt flow index greater than 33, measured in accordance with ASTM D 1238, and a styrene content greater than 40%, and(b) a wax,wherein the adhesive has a viscosity less than about 8,500 centipoises at 120°
C.
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Abstract
The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
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Citations
18 Claims
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1. A low application temperature hot melt adhesive comprising:
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(a) at least one styrenic block copolymer which has a melt flow index greater than 33, measured in accordance with ASTM D 1238, and a styrene content greater than 40%, and (b) a wax, wherein the adhesive has a viscosity less than about 8,500 centipoises at 120°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification