WIRELESS STRAIN GAUGE/FLOW SENSOR

• US 20130204202A1
• Filed: 07/19/2012
• Published: 08/08/2013
• Est. Priority Date: 02/08/2012
• Status: Active Grant

• Current Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Furlan, Patrick, Trombly, Nicholas
• Granted Patent: US 9,539,389 B2
• Time in Patent Office: Days
• US Class Current: 604/207
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2205/0294 Piezoelectric materials
• CPC Class Codes: A61M 2205/3317 Electromagnetic, inductive or dielectric measuring means
• CPC Class Codes: A61M 2205/332 Force measuring means
• CPC Class Codes: A61M 2205/3334 Measuring or controlling the flow rate
• CPC Class Codes: A61M 2205/3355 Controlling downstream pump pressure
• CPC Class Codes: A61M 2205/3368 Temperature
• CPC Class Codes: A61M 2205/3372 Temperature compensation
• CPC Class Codes: A61M 2205/3569 sublocal, e.g. between console and disposable
• CPC Class Codes: A61M 2205/3592 using telemetric means, e.g. radio or optical transmission
• CPC Class Codes: A61M 2205/50 with microprocessors or computers
• CPC Class Codes: A61M 2205/6009 for matching patient with his treatment, e.g. to improve transfusion security
• CPC Class Codes: A61M 2205/8243 by induction
• CPC Class Codes: A61M 5/14244 adapted to be carried by the patient, e.g. portable on the body
• CPC Class Codes: A61M 5/1456 with a replaceable reservoir comprising a piston rod to be moved into the reservoir, e.g. the piston rod is part of the removable reservoir
• CPC Class Codes: A61M 5/16854 by monitoring line pressure
• CPC Class Codes: A61M 5/16877 Adjusting flow; Devices for setting a flow rate
• CPC Class Codes: A61M 5/172 electrical or electronic A61M5/16804, A61M5/16831 take precedence
• CPC Class Codes: A61M 5/3134 characterised by constructional features of the distal end, i.e. end closest to the tip of the needle cannula

Abstract

A flow rate sensor is provided in a wireless, leadless package. The flow rate sensor includes a MEMs sensor coupled to an ASIC and an antenna. The flow rate sensor is powered by radiation received from a control module adjacent the flow rate sensor. The flow rate sensor is placed within a fluid and monitors the flow rate of the fluid. The control module is not in the fluid and receives flow rate data from the flow rate sensor.

Claims

1. A system comprising:

a fluid container;

a fluid dispenser coupled to the fluid container and configured to cause the fluid container to dispense fluid;

a sensor module coupled to the fluid container and configured to measure a fluid parameter of the fluid and to transmit the measured fluid parameter as data; and

a control module coupled to the fluid dispenser and to the sensor module, the control module configured to power the sensor module, and to receive the fluid data from the sensor module by near field coupling.

2. The system of claim 1 wherein the sensor module includes:

a sensor configured to sense the fluid parameter; and

an integrated circuit die coupled to the sensor and configured to receive an analog signal from the sensor, the analog signal being indicative of the fluid parameter.

3. The system of claim 2 wherein the integrated circuit die includes a memory.

4. The system of claim 3 wherein the memory stores fluid identity data identifying the fluid in the fluid container and wherein the sensor module is configured to transmit the fluid identity data to the control module.

5. The system of claim 4 wherein the control module controls a flow rate of the fluid based in part on the fluid identity data.

6. The system of claim 2 wherein the integrated circuit die includes an analog-to-digital converter configured to convert the analog signal to a digital signal.

7. A method comprising:

dispensing fluid from a fluid container;

sensing, in a sensor module coupled to the fluid container, a fluid parameter of the fluid;

powering the sensor module by near field coupling with a control module adjacent to the sensor module;

transmitting the fluid parameter as data indicative of the fluid parameter from the sensor module to the control module; and

controlling a flow rate of the fluid based in part on the fluid data.

8. The method of claim 7 comprising transmitting a fluid identification code from the sensor module to the control module.

9. The method of claim 8 wherein the fluid identification code is stored in a memory of the sensor module.

10. The method of claim 9 comprising:

receiving the fluid identification code in the control module; and

dispensing the fluid only if the fluid identification code corresponds to an expected fluid identification.

11. The method of claim 7 wherein the fluid parameter is a pressure of the fluid.

12. The method of claim 7 wherein the fluid parameter is the flow rate of the fluid.

13. A device comprising:

a fluid sensor configured to sense a fluid parameter and to output an analog fluid signal indicative of the fluid parameter; and

an integrated circuit die packaged with the fluid sensor and electrically coupled thereto, the integrated circuit die configured to receive the analog fluid signal, to convert the analog fluid signal to a digital fluid signal, to be powered by near field coupling with an adjacent control module, and to output the digital fluid signal to the control module.

14. The device of claim 13 comprising an antenna coupled to the integrated circuit die and packaged therewith, the antenna being configured to receive an RF signal from the control module.

15. The device of claim 14 comprising:

a first substrate, the antenna being positioned on the first substrate; and

a second substrate, the fluid sensor being positioned on the second substrate, the integrated circuit die being positioned between the first and second substrates.

16. The device of claim 15 wherein the first and second substrates are glass.

17. The device of claim 16 wherein the first and second substrates are flex substrates.

18. The device of claim 13 comprising a temperature sensor coupled to the integrated circuit die.