LIGHT EMITTER DEVICES HAVING IMPROVED LIGHT OUTPUT AND RELATED METHODS

• US 20130207130A1
• Filed: 04/11/2012
• Published: 08/15/2013
• Est. Priority Date: 02/13/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Reiherzer, Jesse Colin
• Granted Patent: US 9,343,441 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

Light emitter devices having improved light output and related methods are disclosed. In one embodiment, light emitter devices can include a light emission area including one or more light emitting chips. The emitter device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete layer of optically clear material. The device can optionally include more than one discrete layer of optically clear material. Each of the discrete layers of material can be separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device.

Claims

1. A light emitter device comprising:

a light emission area comprising one or more light emitting chips; and

a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises;

a first discrete layer of phosphor containing material; and

second and third discrete layers of optically clear material;

wherein each discrete layer of material is separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device.

2. The device of claim 1, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

3. The device of claim 1, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

4. The device of claim 1, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

5. The device of claim 1, wherein the second and third discrete layers of optically clear material comprise a silicone, epoxy, or glass material.

6. The device of claim 5, wherein the silicone material comprises a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

7. The device of claim 5, wherein the silicone material comprises a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

8. The device of claim 5, wherein the silicone material comprises a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

9. The device of claim 1, wherein each of the second and third discrete layers of optically clear material increases a distance between the one or more light emitting chips and an air interface by approximately 0.2 and 0.5 mm.

10. The device of claim 1, wherein a distance between the one or more light emitting chips and an air interface can be increased to approximately 2 mm by increasing one or more walls of the light emission area by approximately 0.2 mm to 1.5 mm.

11. The device of claim 1, wherein a retention material is disposed about the light emission area.

12. The device of claim 11, wherein a distance between the one or more light emitting chips and an air interface is increased by a secondary dam dispensed about the retention material.

13. The device of claim 12, wherein the secondary dam is taller than the retention material.

14. The device of claim 1, wherein the second discrete layer of material is directly disposed over the first discrete layer of material.

15. The device of claim 1, wherein the first discrete layer of phosphor containing material is disposed between the first and third discrete layers of optically clear material.

16. The device of claim 1, wherein the first discrete layer is directly disposed over a portion of the one or more light emitting chips.

17. The device of claim 1, wherein the second discrete layer is directly disposed over a portion of the one or more light emitting chips.

18. The device of claim 1, wherein each of the discrete layers of material comprise approximately the same thickness.

19. The device of claim 1, further comprising a fourth discrete layer of phosphor containing material.

20. The device of claim 1, wherein the light emission area comprises a cavity with the one or more light emitting chips disposed therein.

21. The device of claim 20, wherein the cavity comprises a cavity volume and approximately 50% of the cavity volume is filled with the first discrete layer of material, approximately 25% of the cavity volume is filled with the second discrete layer of material, and approximately 25% of the cavity volume is filled with the third discrete layer of material.

22. The device of claim 20, wherein the cavity comprises a cavity volume and approximately 40% of the cavity volume is filled with the first discrete layer of material, approximately 30% of the cavity volume is filled with the second discrete layer of material, and approximately 30% of the cavity volume is filled with the third discrete layer of material.

23. The device of claim 1, wherein the device comprises a light output of approximately 1160 to 1190 lm at 270 mA.

24. A light emitter device comprising:

a light emission area comprising a cavity with one or more light emitting chips disposed therein; and

a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises;

a first discrete layer of phosphor containing material; and

a second discrete layer of optically clear material;

wherein the cavity comprises a cavity volume and at least approximately 25% of the cavity volume is filled with the first discrete layer of material and at least approximately 25% of the cavity volume is filled with the second discrete layer of material.

25. The device of claim 24, wherein approximately 50% of the cavity volume is filled with the first discrete layer of material and approximately 50% of the cavity volume is filled with the second discrete layer of material.

26. The device of claim 24, wherein approximately 25% of the cavity volume is filled with the first discrete layer of material and approximately 75% of the cavity volume is filled with the second discrete layer of material.

27. The device of claim 24, wherein approximately 75% of the cavity volume is filled with the first discrete layer of material and approximately 25% of the cavity volume is filled with the second discrete layer of material.

28. The device of claim 24, further comprising a third discrete layer of phosphor containing material.

29. The device of claim 24, further comprising a third discrete layer of optically clear material.

30. The device of claim 28, wherein the second discrete layer of material is directly disposed over the first discrete layer of material, and the third discrete layer of material is directly disposed over the second discrete layer of material.

31. The device of claim 29, wherein the second discrete layer of material is directly disposed over the first discrete layer of material, and the third discrete layer of material is directly disposed over the second discrete layer of material.

32. A method of providing a light emitter device, the method comprising:

providing a light emission area comprising a cavity;

providing one or more light emitting chips within the cavity;

sequentially dispensing a first discrete layer of phosphor containing material and a second discrete layer of optically clear material within the cavity, wherein at least approximately 25% of a cavity volume is filled with the first discrete layer of material and at least approximately 25% of the cavity volume is filled with the second discrete layer of material.

33. The method of claim 32, wherein approximately 50% of the cavity volume is filled with the first discrete layer of material and approximately 50% of the cavity volume is filled with the second discrete layer of material.

34. The method of claim 32, wherein approximately 25% of the cavity volume is filled with the first discrete layer of material and approximately 75% of the cavity volume is filled with the second discrete layer of material.

35. The method of claim 32, wherein approximately 75% of the cavity volume is filled with the first discrete layer of material and approximately 25% of the cavity volume is filled with the second discrete layer of material.

36. The method of claim 32, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

37. The method of claim 32, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

38. The method of claim 32, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

39. The method of claim 32, wherein the second discrete layer of optically clear material comprises a silicone, epoxy, or glass material.

40. The device of claim 39, wherein the silicone material comprises a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

41. The method of claim 39, wherein the silicone material comprises a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

42. The method of claim 39, wherein the silicone material comprises a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

43. The method of claim 32, further comprising increasing a distance between the one or more light emitting chips and an air interface by approximately 0.2 and 0.5 mm by application of the second discrete layer of optically clear material.

44. The method of claim 32, further comprising increasing a distance between the one or more light emitting chips and an air interface to approximately 2 mm by increasing one or more walls of the light emission area by approximately 0.2 mm to 1.5 mm.

45. The method of claim 32, further comprising dispensing a retention material about the light emission area.

46. The method of claim 45, further comprising dispensing a secondary dam about the retention material.

47. The method of claim 46, wherein the secondary dam is approximately 0.2 mm to 1.5 mm taller than the retention material.

48. The method of claim 32, wherein the second discrete layer of material is directly dispensed over the first discrete layer of material.

49. The method of claim 32, further comprising dispensing a third discrete layer of optically clear material.

50. The method of claim 49, wherein the first discrete layer of phosphor containing material is disposed between the first and third discrete layers of optically clear material.

51. The method of claim 32, wherein sequentially applying the first and second layers of material comprises dispensing the first discrete layer over a portion of the one or more light emitting chips.

52. The method of claim 32, wherein sequentially applying the first and second layers of material comprises dispensing the second discrete layer directly over a portion of the one or more light emitting chips.

53. The method of claim 32, wherein the first and second discrete layers of material comprise approximately the same thickness.

54. The method of claim 32, further comprising curing the first and second discrete layers of material at the same time.

55. The method of claim 32, further comprising curing the first discrete layer of material at a different time than the second discrete layer of material.

56. A light emitter device comprising:

a light emission area comprising one or more light emitting chips; and

a filling material at least partially disposed over the one or more light emitting chips, wherein the filling material comprises;

a first discrete layer of phosphor containing material; and

a second discrete layer of optically clear material;

wherein the second discrete layer of optically clear material increases a distance between the light emitting chip and an air interface by approximately 0.2 to 0.5 mm.

57. The device of claim 56, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

58. The device of claim 56, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

59. The device of claim 56, wherein the first discrete layer of phosphor containing material comprises one or more phosphors disposed in a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

60. The device of claim 56, wherein the second discrete layer of optically clear material comprises a silicone, epoxy, or glass material.

61. The device of claim 60, wherein the silicone material comprises a low refractive index (RI) silicone encapsulant having a RI of approximately 1.4 or less.

62. The device of claim 60, wherein the silicone material comprises a high refractive index (RI) silicone encapsulant having a RI of approximately 1.5 or more.

63. The device of claim 60, wherein the silicone material comprises a medium refractive index (RI) silicone encapsulant having a RI of approximately 1.4 to 1.5.

64. The device of claim 56, wherein a retention material is disposed about the light emission area.

65. The device of claim 64, wherein a distance between the one or more light emitting chips and the air interface is increased by a secondary dam dispensed about the retention material.

66. The device of claim 56, wherein the second discrete layer of material is directly disposed over the first discrete layer of material.

67. The device of claim 56, wherein filling material comprises a third discrete layer of optically clear material.

68. The device of claim 67, wherein the first discrete layer of phosphor containing material is disposed between the first and third discrete layers of optically clear material.

69. The device of claim 56, wherein the first and second discrete layers of material are approximately the same thickness.

70. The device of claim 56, wherein the light emission area comprises a cavity with the one or more light emitting chips disposed therein.

71. The device of claim 70, wherein the cavity comprises a cavity volume and approximately 25% of a cavity volume is filled with the first discrete layer of phosphor containing material and approximately 75% of the cavity volume is filled with the second discrete layer of phosphor containing material.

72. The device of claim 70, wherein the cavity comprises a cavity volume and approximately 75% of the cavity volume is filled with the first discrete layer of phosphor containing material and approximately 25% of the cavity volume is filled with the second discrete layer of phosphor containing material.

73. The device of claim 56, wherein the device comprises a light output of approximately 1160 to 1190 lm at 270 mA.