METHOD AND APPARATUS FOR INTERROGATING AN ELECTRONIC COMPONENT

• US 20130207681A1
• Filed: 01/30/2013
• Published: 08/15/2013
• Est. Priority Date: 03/07/2006
• Status: Abandoned Application

• Current Assignee: Scanimetrics, Inc.
• Original Assignee: Scanimetrics, Inc.
• Inventors: Slupsky, Steven, Sellathamby, Christopher
• Application Number:
  US13/754,653
• Publication Number:
  US 20130207681A1
• Time in Patent Office: Days
• US Class Current: 324/754.21
• CPC Class Codes: G01R 1/07 Non contact-making probes
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/31724 Test controller, e.g. BIST state machine for scan test G01R31/318555
• CPC Class Codes: G01R 31/318572 Input/Output interfaces
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Claims

1. An apparatus for interrogating an electronic component, comprising:

an electronic component comprising one or more discrete circuits on a substrate suitable for being packaged in an integrated circuit package;

a body functioning as a test access port or system access port on the substrate, the body being connected to one or more discrete circuit of the electronic component, the body being separate and distinct from an interrogating device, the body having an interface for wireless communication with the interrogating device, the body having a logic circuit for converting instructions from the interrogating device into control signals, communication signals or both to be applied to the discrete circuits.

2. The apparatus of claim 23, wherein the body is a bare die mounted to the substrate.

3. The apparatus of claim 23, wherein the body is incorporated within an integrated circuit that performs other functions.

4. The apparatus of claim 23, wherein the body is integrally formed within the substrate.

5. The apparatus of claim 23, wherein the body is a discrete component positioned upon an integrated circuit.

6. The apparatus of claim 23, wherein the interface includes at least one of a transmitter, a receiver, and a transceiver.

7. The apparatus of claim 28, wherein the interface includes at least one transceiver having a separate transmitter circuit and a separate receiver circuit.

8. The apparatus of claim 23, wherein the interface comprises an antenna for capacitive coupling, inductive coupling, or transmitting electromagnetic waves.

9. The apparatus of claim 23, wherein the logic circuit includes a pattern generator.

10. The apparatus of claim 23, wherein the body has an output verification circuit for verifying the outputs of the electronic component.

11. The apparatus of claim 23, wherein the body has at least one of an analog to digital converter or a digital to analog converter.

12. The apparatus of claim 23, wherein the interface comprises a wireless communication block having a transmitter and a receiver.

13. The apparatus of claim 23, wherein the body includes a wired input adapted to receive at least one of data and power.

14. The apparatus of claim 35, wherein the wired input is contact pad.

15. The apparatus of claim 35, wherein the wired input is a multi-contact panel.

16. The apparatus of claim 23, wherein the substrate comprises more than one discrete circuit.

17. The apparatus of claim 38, wherein the body enables the more than one discrete circuits to be interrogated at least one of in parallel or in series, or individually.

18. The apparatus of claim 23, wherein the body is wirebonded to the electronic component.

19. The apparatus of claim 23, wherein the body is in a flipchip arrangement with the electronic component.

20. The apparatus of claim 23, wherein the interface comprises multiple antennas connected for communicating with an interrogating device in parallel across multiple channels.

21. The apparatus of claim 23, wherein the electronic component comprises an integrated circuit package that includes the body, the substrate and the discrete circuits.