LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF

• US 20130214302A1
• Filed: 02/08/2013
• Published: 08/22/2013
• Est. Priority Date: 02/17/2012
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yeh, Wen-Yung, Tiao, Kuo-Tung, Chao, Chia-Hsin, Yen, Hsi-Hsuan, Wu, Ming-Hsien, Lin, Jui-Ying, Chu, Ying-Chien
• Granted Patent: US 9,281,451 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2113/20 of different form
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

Claims

1. A fabricating method of a light emitting element comprising:

providing a substrate;

forming a plurality of first concaves and a plurality of second concaves on the substrate, wherein a volume of each first concave is different from a volume of each second concave;

providing a plurality of first light emitting diode chips and a plurality of second light emitting diode chips, wherein a volume of each first light emitting diode chip is corresponded to the volume of each first concave, and a volume of each second light emitting diode chip is corresponded to the volume of each second concave; and

moving the first light emitting diode chips onto the substrate so that the first light emitting diode chips go into the first concaves, and moving the second light emitting diode chips onto the substrate so that the second light emitting diode chips go into the first concaves.

2. The fabricating method of the light emitting element as recited in claim 1, wherein a shape of each first concave is different from a shape of each second concave.

3. The fabricating method of the light emitting element as recited in claim 1 further comprising:

forming a plurality of third concaves on the substrate, wherein a volume of each third concave is different from the volume of each first concave and the volume of each second concave;

providing a plurality of third light emitting diode chips, wherein a volume of each third light emitting diode chip is corresponded to a volume of each third concave; and

moving the third light emitting diode chips onto the substrate so that the third light emitting diode chips go into the third concaves.

4. The fabricating method of the light emitting element as recited in claim 1, wherein the step of forming the first concaves comprises:

making an inner wall of each first concave into a cambered surface.

5. The fabricating method of the light emitting element as recited in claim 1 further comprising:

forming a reflective layer at an inner wall of each first concave.

6. The fabricating method of the light emitting element as recited in claim 5 further comprising:

disposing an electrode within each first concave; and

electrically connecting the reflective layer to the electrode.

7. The fabricating method of the light emitting element as recited in claim 1 further comprising:

disposing a first electrode at a first region within each first concave, wherein a shape of the first region is corresponded to a shape of a positive electrode terminal of each first light emitting diode chip; and

disposing a second electrode at a second region within each first concave, wherein the shape of the first region is different from a shape of the second region, and the shape of the second region is corresponded to a shape of a negative electrode terminal of each first light emitting diode chip.

8. The fabricating method of the light emitting element as recited in claim 1 further comprising:

disposing positive and negative electrodes of periodically staggered arrangement within each first concave, wherein when the positive and negative electrodes on each first light emitting diode chip go into each first concave, the positive and negative electrodes are adapted to respectively contact the positive and negative electrodes of periodically staggered arrangement.

9. The fabricating method of the light emitting element as recited in claim 1 further comprising:

disposing a positive electrode pad and a negative electrode pad at a surface of each first light emitting diode chip, wherein one of the positive electrode pad and the negative electrode pad is located at the geometric center of the surface;

disposing a first electrode at the geometric center of a bottom surface of each first concave; and

disposing a second electrode at the bottom surface of each first concave, wherein the second electrode appears to be in ring-shaped and symmetrically surrounds the first electrode, and a distance between the first electrode and the second electrode equals to a distance between the positive electrode pad and the negative electrode pad.

10. The fabricating method of the light emitting element as recited in claim 1, wherein each first concave and each second concave open at a surface of the substrate, and the steps for forming the first concaves and the second concaves comprise:

enabling a profile of each first concave at the surface to correspond to a profile of a cross section of each first light emitting diode chip; and

enabling a profile of each second concave at the surface to correspond to a profile of a cross section of each second light emitting diode chip and to be different from the profile of each first concave at the surface.

11. The fabricating method of the light emitting element as recited in claim 1, wherein when moving the first light emitting diode chips onto the substrate, a portion of the first light emitting diode chips go into the first concaves, and another portion of the first light emitting diode chips go into the second concaves and protrude out of a surface of the substrate, and the fabricating method of the light emitting element further comprises:

removing the first light emitting diode chips protruded out of the surface.

12. The fabricating method of the light emitting element as recited in claim 1 further comprising:

forming a first electrode within each first concave; and

forming a second electrode within each second concave, wherein a material of the first electrode is different from a material of the second electrode, the first electrode is adapted to be soldered with a first soldering temperature, and the second electrode is adapted to be soldered with a second soldering temperature.

13. The fabricating method of the light emitting element as recited in claim 1 further comprising:

forming optical microstructures on each first light emitting diode chip and on each second light emitting diode chip.

14. The fabricating method of the light emitting element as recited in claim 1, wherein each first concave has an opening terminal and a bottom surface, and the step of forming the first concaves comprises:

gradually shrinking each first concave from the opening terminal toward to the bottom surface.

15. A light emitting element comprising:

a substrate having a plurality of first concaves and a plurality of second concaves, wherein a volume of each first concave is different from a volume of each second concave;

a plurality of first light emitting diode chips, wherein a volume of each first light emitting diode chip is corresponded to the volume of each first concave, and the first light emitting diode chips are located within the first concaves; and

a plurality of second light emitting diode chips, wherein a volume of each second light emitting diode chip is corresponded to the volume of each second concave, and the second light emitting diode chips are located within the second concaves.

16. The light emitting element as recited in claim 15, wherein a shape of each first concave is different from a shape of each second concave.

17. The light emitting element as recited in claim 16 further comprising a plurality of third light emitting diode chips, wherein the substrate further has a plurality of third concaves, a volume of each third concave is different from the volume of each first concave and the volume of each second concave, a volume of each third light emitting diode chip is corresponded to the volume of each third concave, and the third light emitting diode chips are located within the third concaves.

18. The light emitting element as recited in claim 15, wherein an inner wall of each first concave is a cambered surface.

19. The light emitting element as recited in claim 15, wherein an inner wall of each first concave has a reflective layer thereon.

20. The light emitting element as recited in claim 19, wherein each first concave has an electrode therewithin, and the reflective layer is electrically connected to the electrode.

21. The light emitting element as recited in claim 15, wherein a first region within each first concave has a first electrode, a shape of the first region is corresponded to a shape of a positive electrode terminal of each first light emitting diode chip, the first electrode is electrically connected to the positive electrode terminal, a second region within each first concave has a second electrode, the shape of the first region is different from a shape of the second region, the shape of the second region is corresponded to a shape of a negative electrode terminal of each first light emitting diode chip, and the second electrode is electrically connected to the negative electrode terminal.

22. The light emitting element as recited in claim 15, wherein a surface of each first light emitting diode chip has a positive electrode pad and a negative electrode pad, one of the positive electrode pad and the negative electrode pad is located at the geometric center of the surface, the geometric center of a bottom surface of each first concave has a first electrode and a second electrode, the second electrode appears to be in ring-shaped and symmetrically surrounds the first electrode, a distance between the first electrode and the second electrode equals to a distance between the positive electrode pad and the negative electrode pad, the first electrode is electrically connected to one of the positive electrode pad and the negative electrode pad, and the second electrode is electrically connected to another one of the positive electrode pad and the negative electrode pad.

23. The light emitting element as recited in claim 15, wherein each first concave and each second concave open at a surface of the substrate, a profile of each first concave at the surface is corresponded to a profile of a cross section of each first light emitting diode chip, and a profile of each second concave at the surface is corresponded to a profile of a cross section of each second light emitting diode chip and different from the profile of each first concave at the surface.

24. The light emitting element as recited in claim 15, wherein each first concave has a first electrode therewithin, each second concave has a second electrode therewithin, a material of the first electrode is different from a material of the second electrode, the first electrode is adapted to be soldered with a first soldering temperature, and the second electrode is adapted to be soldered with a second soldering temperature.

25. The light emitting element as recited in claim 15, wherein each first light emitting diode chip and the each second light emitting diode chip have optical microstructures thereon.

26. The light emitting element as recited in claim 15, wherein each first concave has an opening terminal and a bottom surface, and each first concave gradually shrinks from the opening terminal toward to the bottom surface.