3D-IC DIFFERENTIAL SENSING AND CHARGE SHARING SCHEME
First Claim
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1. A 3D-IC differential sensing and charge sharing scheme, comprising:
- a plurality of high loading structures, including a first high loading structure a second high loading structure;
a tracking circuit coupled to said first high loading structure;
a sensing circuit coupled to said second high loading structure and said tracking circuit;
a plurality of equaling circuits, a first equaling circuit of said plurality of equaling circuits arranged between two high loading structures of said plurality of high loading structures adjacent said first equaling circuit and coupled thereof; and
a clamping circuit coupled to said first high loading structure.
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Abstract
The present invention discloses a 3D-IC differential sensing and charge sharing scheme which includes a plurality of TSVs including a first TSV and a second TSV. A tracking circuit is coupled to the first TSV. A sensing circuit is coupled to the second TSV and the tracking circuit. A plurality of equaling circuits are provided and wherein each of equaling circuit is configured and electrically connected between adjacent two equaling circuits. A clamping circuit is coupled to the first TSV.
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Citations
12 Claims
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1. A 3D-IC differential sensing and charge sharing scheme, comprising:
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a plurality of high loading structures, including a first high loading structure a second high loading structure; a tracking circuit coupled to said first high loading structure; a sensing circuit coupled to said second high loading structure and said tracking circuit; a plurality of equaling circuits, a first equaling circuit of said plurality of equaling circuits arranged between two high loading structures of said plurality of high loading structures adjacent said first equaling circuit and coupled thereof; and a clamping circuit coupled to said first high loading structure. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A 3D-IC differential sensing and charge sharing scheme, comprising:
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a high loading structure; a sensing circuit, coupled to said high loading structure; an equaling circuit, coupled to a positive input terminal and a negative input terminal of said sensing circuit, and coupled to said high loading structure; and a capacitor, coupled to one terminal of said equaling circuit and said negative input terminal of said sensing circuit for storing charge. - View Dependent Claims (8, 9)
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10. A method for charge-sharing of 3D-IC, comprising:
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equaling all TSV signals; opening a clamping circuit, and comparing a voltage of a first TSV of said all TSV; if said voltage of said first TSV exceeds a specified range, then sending a pulse control signal for pre-charging to said first TSV, and thereby supplementing charge in a circuit to maintain a first voltage; and opening a sensing circuit to output a sensing data or signal, and thereby determining a digital status as one or zero. - View Dependent Claims (11, 12)
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Specification