HEAT-DISSIPATION STRUCTURE FOR MOTOR CONTROLLER

• US 20130215575A1
• Filed: 03/18/2013
• Published: 08/22/2013
• Est. Priority Date: 08/30/2011
• Status: Active Grant

• Current Assignee: Zhongshan Broad-Ocean Motor Manufacturing Co., Ltd.
• Original Assignee: Zhongshan Broad-Ocean Motor Manufacturing Co., Ltd.
• Inventors: ZHAO, Yong, WU, Yonghua
• Granted Patent: US 9,420,723 B2
• Time in Patent Office: Days
• US Class Current: 361/714
• CPC Class Codes: H02K 11/33 Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

A heat-dissipation structure for a motor controller. The heat-dissipation structure includes a control box, a circuit board, a plurality of radiators, and IGBT modules. The circuit board is installed in the control box. Each radiator includes a side plate and a heat dissipation block protruding from the side plate. The side plate is attached to an inner wall surface of the control box. The IGBT modules are installed on the heat dissipation block, and the pin terminals protruding from the IGBT modules are in electric or electronic connection with the circuit board.

Claims

1. A heat-dissipation structure for a motor controller, the heat-dissipation structure comprising:

a) a control box (1);

b) a circuit board (2);

c) a plurality of radiators (3); and

d) IGBT modules (4);

wherein

the circuit board (2) is installed in the control box (1);

each radiator (3) comprises a side plate (31) and a heat dissipation block (32) protruding from the side plate (31);

the side plate (31) is attached to an inner wall surface of the control box (1);

the IGBT modules (4) are installed on the heat dissipation block (32); and

pin terminals (41) protruding from the IGBT modules (4) are in electric connection with the circuit board (2).

2. The heat-dissipation structure of claim 1, wherein

baffle plates (33) extend out from edges at tail ends of the heat dissipation block (32);

the IGBT modules (4) are arranged between the baffle plates (33) and the side plate (31);

screws (5) pass through the IGBT modules (4) and are embedded in threaded holes (320) formed on side surfaces of the heat dissipation block (32); and

the IGBT modules (4) are locked on the side surfaces of the heat dissipation block (32).

3. The heat-dissipation structure of claim 1, wherein

a left connecting plate (34) and a right connecting plate (35) extend out from two ends of the side plate (31), respectively;

a groove (340) is formed on the left connecting plate (34); and

a lug boss (350) is protruding from the right connecting plate (35), and embedded in the groove (340) on the left connecting plate (34) of an adjacent radiator (3).

4. The heat-dissipation structure of claim 2, wherein

a left connecting plate (34) and a right connecting plate (35) extend out from two ends of the side plate (31), respectively;

a groove (340) is formed on the left connecting plate (34); and

a lug boss (350) is protruding from the right connecting plate (35), and embedded in the groove (340) on the left connecting plate (34) of an adjacent radiator (3).

5. The heat-dissipation structure of claim 1, wherein mounting holes are formed on the side plate, and screws (6) pass through an outer wall of the control box (1) and are embedded in the mounting holes (310) for locking the radiators (3) on an inner wall of the control box (1).

6. The heat-dissipation structure of claim 2, wherein mounting holes are formed on the side plate, and screws (6) pass through an outer wall of the control box (1) and are embedded in the mounting holes (310) for locking the radiators (3) on an inner wall of the control box (1).

7. The heat-dissipation structure of claim 1, wherein a plurality of radiating ribs (11) is protruding from an outer side of the side plate (31) and an outer wall of the control box (1).

8. The heat-dissipation structure of claim 1, wherein the number of the radiators is three, the number of the IGBT modules is six, each two IGBT modules constitute a group, and the IGBT modules are installed on the radiators (3).

9. The heat-dissipation structure of claim 1, wherein the side plate (31), the heat dissipation block (32), the baffle plates (33), the left connecting plate (34) and the right connecting plate (35) are integrally formed.

10. The heat-dissipation structure of claim 2, wherein the side plate (31), the heat dissipation block (32), the baffle plates (33), the left connecting plate (34) and the right connecting plate (35) are integrally formed.

11. The heat-dissipation structure of claim 9, wherein the radiators are made of aluminum.

12. The heat-dissipation structure of claim 10, wherein the radiators are made of aluminum.