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METHOD AND DEVICE FOR CONTROLLING PATTERN AND STRUCTURE FORMATION BY AN ELECTRIC FIELD

  • US 20130217210A1
  • Filed: 07/31/2012
  • Published: 08/22/2013
  • Est. Priority Date: 08/02/2011
  • Status: Active Grant
First Claim
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1. A processing apparatus, comprising:

  • a processing chamber configured to receive a processing medium that is subject to being affected by an electric field while processing a substrate;

    a substrate holder for holding a substrate to be processed within the chamber;

    at least one electric field applicator operable to expose the substrate during processing to a non-uniform, spatial-temporal electric field that is capable of affecting the processing medium, when the electric field applicator is electrically energized by an electrical bias and the processing medium becomes dipolar in the presence of the electric field;

    a distribution coupling unit operable to couple a time-varying electrical bias to the at least one electric field applicator to thereby energize the electric field applicator to interact with the dipolar properties of the medium or particles therein;

    wherein the processing medium or particles therein are affected by the electric field; and

    a spatial-temporal electric field being an electric field that varies as a function of time and of position relative to the substrate, the function being effective to move, align or otherwise affect the medium or particles in processing of or on the substrate.

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