METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

• US 20130219712A1
• Filed: 02/26/2013
• Published: 08/29/2013
• Est. Priority Date: 02/29/2012
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: SUZUKI, Kenji
• Granted Patent: US 9,179,553 B2
• Time in Patent Office: Days
• US Class Current: 29/841
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/2518 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/73259 Bump and HDI connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2203/1536 Temporarily stacked PCBs
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Embodiments disclosed herein include a method of manufacturing a multilayer wiring board that includes the steps of forming, on a support substrate, a laminate in which insulating layers and conductor layers are alternately laminated, accommodating a semiconductor chip in an opening of a prepreg which is formed on the surface of the laminate and that includes a sheet-like glass fiber impregnated with resin, and heating and pressurizing the surface of the prepreg in a state where the semiconductor chip is accommodated in the opening.

Claims

1. A method of manufacturing a multilayer wiring board in which a plurality of insulating layers and a plurality of conductor layers are alternately laminated, the method comprising:

a first step of forming, on a support substrate, a laminate in which at least one insulating layer and at least one conductor layer are alternately laminated;

a second step of fixing an electronic component on a surface of the laminate formed by the first step;

a third step of forming an opening capable of accommodating the electronic component in a prepreg which includes a sheet-like glass fiber impregnated with resin;

a fourth step of laminating the prepreg with the opening formed by the third step on the surface of the laminate such that the electronic component fixed by the second step is accommodated in the opening; and

a fifth step of heating and pressurizing a surface of the prepreg laminated on the surface of the laminate by the fourth step.

2. The method according to claim 1, wherein:

in the first step, pads for electrical connection to connection terminals of the electronic component are formed on the surface of the laminate, and

in the second step, after a solder paste is provided on the pads and the electronic component is placed on the surface of the laminate, the solder paste is reflowed to fix the electronic component such that voids are formed between the pads and the connection terminals.

3. The method according to claim 2, wherein, when a direction orthogonal to a lamination direction of the laminate is referred to as a lamination orthogonal direction, a length in the lamination orthogonal direction of the pads is shorter than a length in the lamination orthogonal direction of the electronic component placed on the surface of the laminate.

4. The method according to claim 1, wherein:

an insulating layer, including on a surface thereof a metal layer serving as a conductor layer that is formed through patterning and including a sheet-like glass fiber impregnated with resin, is laminated on the surface of the prepreg, and

in the fifth step, the prepreg is heated and pressurized through the metal layer.

5. A method of manufacturing a multilayer wiring board in which a plurality of insulating layers and a plurality of conductor layers are alternately laminated, the method comprising:

a step of forming, on a support substrate, a laminate in which at least one insulating layer and at least one conductor layer are alternately laminated;

a step of forming a prepreg, which has an opening capable of accommodating an electronic component and a sheet-like glass fiber impregnated with resin, on a surface of the laminate;

a step of accommodating the electronic component in the opening; and

a step of heating and pressurizing a surface of the prepreg.

6. The method according to claim 5, wherein the step of forming the prepreg includes:

a step of forming the opening in the prepreg, and

a step of laminating the prepreg having the opening on the surface of the laminate.

7. The method according to claim 5, wherein the step of forming the prepreg includes, in the following order:

a step of laminating the prepreg on the surface of the laminate, and

a step of forming the opening in the prepreg.