TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEROF

• US 20130221383A1
• Filed: 02/26/2013
• Published: 08/29/2013
• Est. Priority Date: 02/27/2012
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Hyung Kun, LEE, Soo Jeong
• Application Number:
  US13/777,962
• Publication Number:
  US 20130221383A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10S 977/762 Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
• CPC Class Codes: Y10S 977/95 Electromagnetic energy

Abstract

A light emitting diode (LED) package and a method of fabricating an LED package are provided. The LED package can include a transparent substrate and an LED arranged on the transparent substrate. A reflective layer and/or a polarizing layer can also be included. The LED may be disposed on one surface of the transparent substrate with the reflective layer and/or polarizing layer formed on an opposing surface of the transparent substrate. The fabrication method may include forming an LED on one surface of a transparent substrate by mounting a flip-chip on the transparent substrate or vapor-depositing the LED directly on the transparent substrate. A multi-package stacked structure can also be provided wherein a plurality of LED packages are stacked together unidirectionally or bidirectionally, with or without a reflective layer and/or a polarizing layer.

Claims

1. A light emitting diode (LED) package comprising:

a transparent substrate including at least one material selected from a group consisting of;

indium tin oxide (ITO), a carbon nanotube (CNT), tin oxide (SnO₂), zinc oxide (ZnO), glass, a conductive polymer, poly(3,4-ethylene dioxythiophene) (PEDOT), grid electrode film (GEF), coating or mesh containing a conductive material, a compound of glass fibers and organic materials, and carbon graphene; and

an LED disposed on one surface of the transparent substrate.

2. The LED package of claim 1, wherein the transparent substrate is a flexible substrate.

3. The LED package of claim 1, wherein the LED is flip-chip bonded to or vapor-deposited on the transparent substrate.

4. The LED package of claim 1, further comprising a reflective layer disposed on the transparent substrate.

5. The LED package of claim 4, wherein the reflective layer is arranged on an opposing surface of the transparent substrate, said opposing surface located opposite the surface on which the LED is disposed.

6. The LED package of claim 5, wherein the reflective layer covers an area of the opposing surface that is larger than an area covered by the LED but smaller than a total area of the opposing surface.

7. The LED package of claim 6, wherein the reflective layer covers all or substantially all of the opposing surface.

8. The LED package of claim 1, further comprising a polarizing layer disposed on the transparent substrate.

9. The LED package of claim 8, further comprising a reflective layer disposed on the polarizing layer.

10. The LED package of claim 1, further comprising at least two LED packages, wherein the at least two LED packages are stacked.

11. The LED package of claim 10, further comprising a reflective layer disposed between the at least two LED packages being stacked.

12. The LED package of claim 10, further comprising a polarizing layer disposed between the at least two LED packages being stacked.

13. A method of fabricating a light emitting diode (LED) package, the fabrication method comprising:

forming an LED on one surface of a transparent substrate,

wherein forming the LED is performed by mounting a flip-chip on the transparent substrate or vapor-depositing the LED directly on the transparent substrate.

14. The method according to claim 13, further comprising forming a polarizing layer on the transparent substrate.

15. The method according to claim 14, wherein the polarizing layer is formed on a surface of the transparent substrate opposite a surface of the transparent substrate on which the LED is formed.

16. The method according to claim 13, further comprising forming a reflective layer on the LED package.

17. The method according to claim 16, wherein the reflective layer is formed on a surface of the transparent substrate opposite a surface of the transparent substrate on which the LED is formed.

18. The method according to claim 15, further comprising forming a reflective layer on the LED package.

19. The method according to claim 18, wherein the reflective layer is formed on the polarizing layer.

20. A light emitting diode (LED) package comprising:

a transparent substrate;

an LED formed on one surface of the transparent substrate; and

a reflective layer or a polarizing layer formed on an opposing surface of the transparent substrate, said opposing surface being located opposite the surface on which the LED is formed.