×

TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEROF

  • US 20130221383A1
  • Filed: 02/26/2013
  • Published: 08/29/2013
  • Est. Priority Date: 02/27/2012
  • Status: Abandoned Application
First Claim
Patent Images

1. A light emitting diode (LED) package comprising:

  • a transparent substrate including at least one material selected from a group consisting of;

    indium tin oxide (ITO), a carbon nanotube (CNT), tin oxide (SnO2), zinc oxide (ZnO), glass, a conductive polymer, poly(3,4-ethylene dioxythiophene) (PEDOT), grid electrode film (GEF), coating or mesh containing a conductive material, a compound of glass fibers and organic materials, and carbon graphene; and

    an LED disposed on one surface of the transparent substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×