SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF ADJUSTING LC COMPONENT OF SURFACE ACOUSTIC WAVE DEVICE

• US 20130222079A1
• Filed: 04/04/2013
• Published: 08/29/2013
• Est. Priority Date: 04/16/2003
• Status: Active Grant

• Current Assignee: Intellectual Ventures Holding 81 LLC (Intellectual Ventures LLC)
• Original Assignee: Intellectual Ventures Fund 77 LLC (Intellectual Ventures LLC)
• Inventors: Anasako, Kenichi
• Granted Patent: US 8,896,397 B2
• Time in Patent Office: Days
• US Class Current: 333/193
• CPC Class Codes: H03H 9/0004 Impedance-matching networks H03H9/145 takes precedence
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/52 Electric coupling means
• CPC Class Codes: H03H 9/64 using surface acoustic waves
• CPC Class Codes: H03H 9/6489 Compensation of undesirable effects

Abstract

A surface acoustic wave device comprises a piezoelectric substrate (1), at least one inter-digital transducers (IDT) (2) provided on the piezoelectric substrate, at least one elongated electrode pad (4) electrically connected to the IDT, and at least one stud bump (5) disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.

Claims

1. A device, comprising:

an electrode pad comprising a first wiring pattern and a second wiring pattern connected together at a common end, wherein the electrode pad is electrically connected to an inter-digital transducer attached to a piezoelectric substrate.

2. The device of claim 1, further comprising a stud bump disposed on the electrode pad.

3. The device of claim 2, wherein a position of the stud bump on the electrode pad sets a value of a product of an inductance and a capacitance of the device.

4. The device of claim 2, wherein the stud bump is disposed on the electrode pad to electrically short-circuit the first wiring pattern and the second wiring pattern.

5. The device of claim 2, wherein an entirety of the stud bump is disposed on one of the first wiring pattern or the second wiring pattern.

6. The device of claim 1, wherein the electrode pad comprises at least three wiring patterns, including the first wiring pattern and the second wiring pattern, and wherein pairs of adjacent wiring patterns of the at least three wiring patterns are connected together at respective common ends.

7. The device of claim 1, further comprising a reflector configured to reflect a surface acoustic wave generated by the inter-digital transducer.

8. The device of claim 1, wherein the inter-digital transducer comprises a first comb-shaped inter-digital transducer positioned opposite a second comb-shaped inter-digital transducer.

9. A method, comprising:

converting a first electrical signal to a surface acoustic wave using at least one electrode pad electrically connected to at least one inter-digital transducer attached to a piezoelectric substrate, wherein the at least one electrode pad comprises a first wiring pattern connected to a second wiring pattern at a common end; and

converting the surface acoustic wave to a second electrical signal by the at least one inter-digital transducer.

10. The method of claim 9, wherein the converting the first electrical signal or the converting the surface acoustic wave comprises converting using an electrode pad of the at least one electrode pad comprising at least one stud bump disposed on the electrode pad.

11. The method of claim 10, further comprising changing a value of a product of an inductance and a capacitance of a surface acoustic wave device comprising the electrode pad by moving the at least one stud bump from a first position on the electrode pad to a second position on the electrode pad.

12. The method of claim 10, further comprising electrically short-circuiting the first wiring pattern and the second wiring pattern with the at least one stud bump.

13. The method of claim 10, wherein an entirety of the at least one stud bump is disposed on the first wiring pattern or the second wiring pattern.

14. The method of claim 10, wherein the at least one electrode pad further comprises a third wiring pattern, and wherein adjacent wiring patterns of the first wiring pattern, the second wiring pattern, or the third wiring pattern are connected at respective common ends.

15. The method of claim 9, wherein the converting the first electrical signal or the converting the surface acoustic wave comprises converting using a reflector configured to reflect the surface acoustic wave.

16. The method of claim 9, wherein the converting the first electrical signal or the converting the surface acoustic wave comprises converting using the at least one inter-digital transducer comprising a first comb-shaped inter-digital transducer positioned opposite a second comb-shaped inter-digital transducer.

17. An apparatus, comprising:

means for converting an electrical signal to a surface acoustic wave; and

means for conducting the electrical signal to the means for converting, wherein the means for conducting comprises a first wiring pattern connected to a second wiring pattern at a common end.

18. The apparatus of claim 17, wherein the means for conducting further comprises bump means attached to the means for conducting.

19. The apparatus of claim 18, wherein the bump means is positioned on the means for conducting to electrically short-circuit the first wiring pattern to the second wiring pattern.

20. The apparatus of claim 18, wherein the bump means is positioned on the means for conducting entirely on one of the first wiring pattern or the second wiring pattern.