ELECTRONIC DEVICE

• US 20130223025A1
• Filed: 08/17/2012
• Published: 08/29/2013
• Est. Priority Date: 08/25/2011
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Nakamura, Takashi, Fujieda, Tadaomi
• Application Number:
  US13/588,100
• Publication Number:
  US 20130223025A1
• Time in Patent Office: Days
• US Class Current: 361/753
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure

Abstract

Provided is an electronic device including a housing, at least a part of which has conductive properties; a substrate on which a heating element is mounted and which has a ground pattern; and a spacer which is located between the housing and the ground pattern and which includes a main body portion having heat insulating properties and a conductive portion which is in contact with the ground pattern and the housing and which conducts current between the ground pattern and the housing.

Claims

1. An electronic device comprising:

a housing, at least a part of which has conductive properties;

a substrate on which a heating element is mounted and which has a ground pattern; and

a spacer which is located between the housing and the ground pattern and which includes a main body portion having heat insulating properties and a conductive portion which is in contact with the ground pattern and the housing and which conducts current between the ground pattern and the housing.

2. The electronic device according to claim 1,

wherein the housing includes a support portion which has conductive properties and which supports the substrate, and

wherein the spacer is provided between the substrate and the support portion.

3. The electronic device according to claim 1,

wherein the spacer is formed by a heat insulating member that is the main body portion, and a conductive member that is the conductive portion.

4. The electronic device according to claim 1,

wherein the spacer has the conductive portion that is formed by performing conductive processing on a surface of a heat insulating member that is the main body portion.

5. The electronic device according to claim 3,

wherein the conductive member includes:

a first ground connection portion that is located between the heat insulating member and the ground pattern;

a second ground connection portion that is located between the heat insulating member and the housing; and

a detour connection portion that detours around the heat insulating member and connects the first ground connection portion with the second ground connection portion.

6. The electronic device according to claim 5,

wherein the conductive member is formed in a U-shape connecting the first ground connection portion, the second ground connection portion and the detour connection portion.

7. The electronic device according to claim 5,

wherein the conductive member includes a heat resistance increasing portion in the detour connection portion.

8. The electronic device according to claim 5,

wherein the conductive member includes a heat dissipation portion in the detour connection portion.

9. The electronic device according to claim 2,

wherein the housing includes a heat dissipation portion in the support portion.