HYBRID HOUSING FOR IMPLANTABLE MEDICAL DEVICE

• US 20130223028A1
• Filed: 07/25/2011
• Published: 08/29/2013
• Est. Priority Date: 07/29/2010
• Status: Abandoned Application

• Current Assignee: Proteus Digital Health, Inc. (Otsuka Holdings Company Limited)
• Original Assignee: Proteus Digital Health, Inc. (Otsuka Holdings Company Limited)
• Inventors: Arne, Lawrence, Jensen, Marc, Thompson, Todd
• Application Number:
  US13/812,849
• Publication Number:
  US 20130223028A1
• Time in Patent Office: Days
• US Class Current: 361/757
• CPC Class Codes: A61L 27/04 Metals or alloys
• CPC Class Codes: A61L 27/10 Ceramics or glasses
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/069 Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Apparatuses and methods for hybrid housings as well as hybrid housing based implantable medical devices are provided. A hybrid housing comprises a ceramic substrate, a bonding structure formed on the periphery of the ceramic substrate, and a biocompatible metal cap coupled to the ceramic substrate using the bonding structure to form a hermetically sealed enclosure. One or more electronic elements may be formed within the hermetically sealed enclosure, and the electronic elements may be stably associated with the ceramic substrate.

Claims

1. An implantable medical device, comprising:

a ceramic substrate;

at least one electronic element stably associated with the ceramic substrate; and

a biocompatible metal cap coupled to the ceramic substrate to form a hermetically sealed enclosure, wherein the at least one electronic element is formed within the hermetically sealed enclosure.

2. The device of claim 1, wherein the ceramic substrate is planar.

3. The device of claim 1, wherein the ceramic substrate is made of alumina, sapphire, or zirconia.

4. The device of claim 1, wherein the biocompatible metal cap is made of titanium, platinum, niobium, or an alloy of the titanium, the platinum, or the niobium.

5. The device of claim 1, wherein the biocompatible metal cap comprises a plurality of corrugations.

6. The device of claim 1, wherein the at least one electronic element is an integrated chip (IC), a passive component, an antenna, a reservoir, a power source, or an electrode.

7. The device of claim 1, wherein the at least one electronic element is formed on the ceramic substrate.

8. The device of claim 6, further comprising a circuit board coupled to the ceramic substrate based on a bonding material, wherein the at least one electronic element is formed on the circuit board.

9. The device of claim 1, further comprising a second biocompatible metal cap coupled to the ceramic substrate, wherein the second biocompatible metal cap is formed on the opposite side of the biocompatible metal cap with respect to the ceramic substrate to form a second hermetically sealed enclosure.

10. The device of claim 9, further comprising a second group of electrical components stably associated with the ceramic substrate, wherein the second group of electronic elements is formed within the second hermetically sealed enclosure.

11. The device of claim 1, wherein a high frequency signal blocked by the biocompatible metal cap is communicated to or from the hermetically sealed enclosure via the ceramic substrate.

12. The device of claim 1, wherein the ceramic substrate is a high temperature cofired ceramic (HTCC) alumina substrate or a low temperature cofired ceramic (LTCC) alumina substrate.

13. The device of claim 12, wherein the ceramic substrate comprises at least one diffusion barrier.

14. A housing for an implantable medical device, comprising:

a ceramic substrate;

a bonding structure formed on a periphery of the ceramic substrate; and

a biocompatible metal cap coupled to the ceramic substrate using the bonding structure to form a hermetically sealed enclosure, wherein at least one electronic element formed within the hermetically sealed enclosure is stably associated with the ceramic substrate.

15. The housing of claim 14, wherein the bonding structure is a metal ring formed on the periphery of the ceramic substrate, and wherein the biocompatible metal cap is welded to the metal ring formed on the periphery of the ceramic substrate.

16. The housing of claim 14, wherein the bonding structure is a metal film deposited on the periphery of the ceramic substrate using a cathodic arc deposition technique, and the biocompatible metal cap is welded to the metal film.

17. A method of forming a housing for an implantable medical device, comprising:

forming a ceramic substrate and a biocompatible metal cap;

stably associating at least one electronic element with the ceramic substrate;

forming a bonding structure on to the substrate;

coupling the biocompatible metal cap on the ceramic substrate using the bonding structure to form a hermetically sealed enclosure.

18. The method of claim 17, wherein the forming the bonding structure comprises forming a metal film on a periphery of the ceramic substrate using a cathodic arc deposition technique.

19. The method of claim 17, wherein the forming the bonding structure comprises forming a metal ring on a periphery of the ceramic substrate.

20. The method of claim 17, wherein the forming the ceramic structure comprises forming at least one diffusion barrier into the ceramic substrate.