LIGHT EMITTING DEVICE WITH ENCAPSULANT FORMED WITH BARRIERS AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME

• US 20130234188A1
• Filed: 04/08/2013
• Published: 09/12/2013
• Est. Priority Date: 10/22/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: HWANG, Jung Ha, JO, Kyoung Woo
• Granted Patent: US 9,190,577 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

Claims

1. A light emitting device comprising:

a light emitting diode chip;

a barrier on a top surface of the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip,

wherein a lateral width of the light emitting diode chip is substantially the same with a lateral width of the encapsulant including the phosphor.

2. The light emitting device as claimed in claim 1, wherein the barrier includes a thixotropic material.

3. The light emitting device as claimed in claim 1, wherein the barrier includes at least two barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

4. The light emitting device as claimed in claim 3, wherein one of the barriers is a dummy pad, and the other one of the barriers is a pad, and wherein the dummy pad is not electrically connected to the pad.

5. The light emitting device as claimed in claim 1, wherein the barrier comprises a plurality of barriers separated from each other, and

the barriers are disposed on a substantially center portion of the outer peripheral portion of the light emitting diode chip.

6. The light emitting device as claimed in claim 1, wherein the barrier is formed on both a side surface and a top surface of an outer peripheral portion of the light emitting diode chip.

7. The light emitting device as claimed in claim 1, wherein the barrier comprises four barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

8. The light emitting device as claimed in claim 7, wherein at least one of the barriers comprises a dummy pad, and at least one of the barriers comprises a pad, and wherein the dummy pad is not electrically connected to the pad.

9. The light emitting device as claimed in claim 1, wherein the barrier is formed on a top surface of an outer peripheral portion of the light emitting diode chip.

10. The light emitting device as claimed in claim 1, wherein the barrier is connected to an outer peripheral portion of the light emitting diode chip.

11. The light emitting device as claimed in claim 1, wherein the barrier includes a conductive material or a nonconductive material.

12. The light emitting device as claimed in claim 1, wherein the encapsulant has a flat top surface.

13. The light emitting device as claimed in claim 12, wherein the flat top surface is substantially the same as a flat top of the barrier.

14. The light emitting device as claimed in claim 1, wherein the encapsulant has a hemispherical shape.

15. The light emitting device as claimed in claim 1, wherein the encapsulating material comprises a flat top surface and the flat top surface of the encapsulating material comprises a roughness.

16. A light emitting device comprising:

a light emitting diode chip;

a barrier on the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip,

wherein the encapsulating material comprises a flat top surface and

wherein the flat top surface is substantially the same as a flat top of the barrier.

17. The light emitting device as claimed in claim 16, wherein the barrier includes at least two barriers separated from each other at an outer peripheral portion of the light emitting diode chip, and

wherein one of the barriers is a dummy pad, and the other one of the barriers is a pad, and wherein the dummy pad is not electrically connected to the pad.

18. The light emitting device as claimed in claim 16, wherein the barrier comprises four barriers separated from each other at an outer peripheral portion of the light emitting diode chip, and

wherein at least one of the barriers comprises a dummy pad, and at least one of the barriers comprises a pad, and wherein the dummy pad is not electrically connected to the pad.

19. The light emitting device as claimed in claim 16, wherein the barrier comprises at least two barriers separated from each other, and

the barriers are disposed on a substantially center portion of the outer peripheral portion of the light emitting diode chip.

20. The light emitting device as claimed in claim 16, wherein the barrier is formed on both a side surface and a top surface of an outer peripheral portion of the light emitting diode chip.