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LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD

  • US 20130234192A1
  • Filed: 02/28/2011
  • Published: 09/12/2013
  • Est. Priority Date: 11/18/2010
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) chip comprising:

  • a semiconductor stack comprising a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer;

    a first electrode pad disposed on the second conductivity-type semiconductor layer;

    a first electrode extension extending from the first electrode pad, the first electrode extension connected to the first conductivity-type semiconductor layer;

    a second electrode pad electrically connected to the second conductivity-type semiconductor layer; and

    an insulation layer interposed between the first electrode pad and the second conductivity-type semiconductor layer.

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