LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD
First Claim
1. A light emitting diode (LED) chip comprising:
- a semiconductor stack comprising a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer;
a first electrode pad disposed on the second conductivity-type semiconductor layer;
a first electrode extension extending from the first electrode pad, the first electrode extension connected to the first conductivity-type semiconductor layer;
a second electrode pad electrically connected to the second conductivity-type semiconductor layer; and
an insulation layer interposed between the first electrode pad and the second conductivity-type semiconductor layer.
2 Assignments
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Accused Products
Abstract
Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
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Citations
44 Claims
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1. A light emitting diode (LED) chip comprising:
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a semiconductor stack comprising a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a first electrode pad disposed on the second conductivity-type semiconductor layer; a first electrode extension extending from the first electrode pad, the first electrode extension connected to the first conductivity-type semiconductor layer; a second electrode pad electrically connected to the second conductivity-type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductivity-type semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A light emitting diode (LED) chip, comprising:
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a first conductivity-type semiconductor layer; a plurality of mesa structures arranged on the first conductivity-type semiconductor layer, each of the plurality of mesa structures comprising a second conductivity-type semiconductor layer and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a first electrode pad, at least a portion thereof being disposed on the second conductivity-type semiconductor layer; a first electrode extension extending from the first electrode pad, the first electrode extension connected to the first conductivity-type semiconductor layer; a second electrode pad electrically connected to the second conductivity-type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductivity-type semiconductor layer. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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Specification