TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS

• US 20130234748A1
• Filed: 03/07/2013
• Published: 09/12/2013
• Est. Priority Date: 03/07/2012
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: Advantest Corporation
• Inventors: NAMBURI, Lakshmikanth, CROS, Florent
• Granted Patent: US 10,859,602 B2
• Time in Patent Office: Days
• US Class Current: 324/756.02
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact.

Claims

1. A method comprising:

forming a plurality of probes in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,

wherein tips of said plurality of probes are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;

attaching said sacrificial material comprising said plurality of probes to a space transformer,

wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes;

removing said sacrificial substrate; and

removing said sacrificial material, while leaving said plurality of probes intact.

2. The method of claim 1 wherein said probe pitch is less than about 50 μ

m.

3. The method of claim 1 wherein said second pitch is at least twice said probe pitch.

4. The method of claim 1 wherein said plurality of probes comprise a nickel-manganese (NiMn) alloy.

5. The method of claim 1 wherein said sacrificial material comprises copper (Cu).

6. The method of claim 1 wherein said removing said sacrificial substrate and said removing said sacrificial material occur at about the same time.

7. The method of claim 1 wherein said removing said sacrificial material takes place subsequent to said attaching.

8. An article of manufacture comprising:

a space transformer having first contacts at a first pitch on a first face, and second contacts at a second pitch on a second face;

a fine pitch space transformer having third contacts at said second pitch on a first face and fourth contacts at a probe pitch on a second face,

said first face of said fine pitch space transformer functionally coupled to said second contacts of said second face of said space transformer; and

a plurality of fine pitch electronic probes, suitable for contacting test points of an integrated circuit, at a probe pitch functionally coupled to said fourth contacts of said second face of said fine pitch space transformer,

wherein said plurality of fine pitch electronic probes are configured to be removed as a whole from an assembly of said space transformer and said fine space transformer.

9. The article of manufacture of claim 8 wherein said probe pitch is less than or equal to about 50 μ

m.

10. The article of manufacture of claim 8 wherein said second pitch is larger than said probe pitch, and less than about 200 μ

m.

11. The article of manufacture of claim 8 wherein said first pitch is larger than said second pitch, and greater than about 200 μ

m.

12. The article of manufacture of claim 8 wherein said plurality of fine pitch electronic probes are mounted to a through via substrate probe carrier having contacts at said probe pitch on both faces.

13. The article of manufacture of claim 12 wherein said plurality of fine pitch electronic probes are configured to be removed as a whole, while coupled to said through via substrate probe carrier, from an assembly of said space transformer and said fine space transformer.

14. The article of manufacture of claim 8 further comprising a printed circuit board having contacts at said first pitch functionally coupled to said space transformer on said first face.

15. A method comprising:

forming a plurality of probes in a primary sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,

wherein tips of said plurality of probes are formed away from said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;

removing said primary sacrificial material;

encapsulating said plurality of probes in a secondary sacrificial material;

bonding said encapsulated plurality of probes to a space transformer; and

removing said secondary sacrificial material.

16. The method of claim 15 wherein said plurality of probes are at a pitch of less than or equal to about 50 μ

m.

17. The method of claim 15 wherein said space transformer comprises first contacts at said probe pitch on one face, and corresponding second contacts on another face at least twice said probe pitch, and wherein corresponding first and second contacts are electrically coupled.

18. The method of claim 15 wherein said plurality of probes comprise a nickel-manganese (NiMn) alloy.

19. The method of claim 15 wherein said primary sacrificial material comprises copper (Cu).

20. The method of claim 15 wherein said removing said secondary sacrificial material takes place subsequent to said bonding.