Apparatus and Method for Inspecting Chip Defects

• US 20130235186A1
• Filed: 03/09/2012
• Published: 09/12/2013
• Est. Priority Date: 03/09/2012
• Status: Abandoned Application

• Current Assignee: National Applied Research Laboratories (Government of The Republic of China)
• Original Assignee: National Applied Research Laboratories (Government of The Republic of China)
• Inventors: Chen, Yung-Hsiang, Chen, Ming-Fu, Huang, Po-Hsuan
• Application Number:
  US13/416,010
• Publication Number:
  US 20130235186A1
• Time in Patent Office: Days
• US Class Current: 348/126
• CPC Class Codes: G01N 21/9515 Objects of complex shape, e.g. examined with use of a surface follower device measuring contours and curvatures G01B11/24
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Disclosed is a chip defect inspection apparatus including a linear array image acquisition module, an illumination control module, a chip defect detection module connected to the LIA module, and an operations and management module connected to the LIA module, the illumination control module and the chip defect detection module.

Claims

1. A chip defect inspection apparatus including an opto-mechanical image acquisition device and a computer supported on a workbench, wherein the chip defect inspection apparatus includes:

a linear array image acquisition module including an opto-mechanical image acquisition module and an image acquisition module for obtaining a raw image of a chip under inspection, wherein the opto-mechanical image acquisition module includes an opto-mechanical module and a line scan imager;

an illumination control module including an illumination control mechanism and an illumination control circuit for regulating a light source to facilitate the linear array image acquisition module to obtain an adequately bright image of the chip, wherein the illumination control mechanism includes an image acquisition area mechanism, an LED illuminator and a radiator;

a chip defect detection module connected to the linear array image acquisition module, wherein the chip defect detection module includes an acquisition sequence control unit, an image acquisition and storage unit, an image processing unit and a defect inspection unit to obtain the raw image of the chip according to synchronization signal from the machine control module, execute defect inspection process according to image processing parameters and determination parameters, and provide the results of inspection; and

an operations and management module connected to the linear array image acquisition module, the illumination control module and the chip defect detection module, wherein the operations and management module includes a graphical user interface for system operations and management, a system configuration unit, a system status handling unit, and an inspection result handling unit for registeration, display and statistics, wherein the operations and management module registers the state of the system, the configuration of the system and the results of the inspection in an archive system, wherein the image acquisition module, the chip defect detection module and the operations and management module are included in the computer.

2. The apparatus according to claim 1,

wherein the chip defect detection module is a software or firmware module based on hardware platform.

3. The apparatus according to claim 1,

wherein the operations and management module is a software module.

4. The apparatus according to claim 1,

wherein the opto-mechanical module includes a lens, a reflector, a filter and adapters.

5. The apparatus according to claim 1,

wherein the light source is selected from the light group consisting of red and near-infrared bands.

6. The apparatus according to claim 1,

wherein the LED illuminator includes a printed circuit board, an LED illumination module and a filter.

7. The apparatus according to claim 1,

wherein the chip defect detection module registers the images in the archive system after the inspection.

8. The apparatus according to claim 1,

wherein the determination parameters include parameters and thresholds for detecting and determining, and parameters of scan window template.

9. The apparatus according to claim 1,

wherein the linear array image acqusition module is supported on the workbench via a holding mechanism.

14. The apparatus according to claim 1,

wherein the chip defect detection module includes an acquisition sequence control unit, an image acquisition and storage unit, an image processing unit and a defect inspection unit.

10. A chip defect inspection method based on edge detection and a binary chip edge image including the instant chip image derivation process and chip defect inspection process.

11-13. -13. (canceled)