POWER ELECTRONIC SYSTEM AND METHOD OF ASSEMBLY
First Claim
1. A power electronic system, comprising:
- a casing comprising;
a case body comprising;
a cooling channel region partially defining a cooling channel, the cooling channel region comprising;
a cooling plate having a first and a second opposing broad face, the first broad face adjacent the cooling channel, cooling features extending from the first broad face of the cooling plate, and a cooling block extending from the second broad face of the cooling plate, the case body further comprising a first access gap defined through the case body;
a first lid that mounts to the case body proximal the first broad face of the cooling plate and cooperatively defines the cooling channel with the case body;
a second lid that mounts to the case body proximal the second broad face of the cooling plate;
a coolant inlet and a coolant outlet fluidly connected to the cooling channel;
a circuit board having a first and a second broad face, wherein the first broad face of the circuit board is mounted to the case body proximal the second broad face of the cooling plate between the case body and the second lid;
a primary electronic component mounted to the first broad face of the circuit board;
a cooling receptacle cooperatively enclosing the passive electronic component with the first broad face of the circuit board, the cooling receptacle thermally connected to the second broad face of the cooling plate;
a secondary electronic component mounted to the first broad face of the circuit board, the secondary electric component thermally connected to the cooling block along a first broad face of the secondary electronic component; and
a retention mechanism extending through a circuit board thickness from the second broad face of the circuit board to bias the secondary electronic component against the cooling block.
1 Assignment
0 Petitions
Accused Products
Abstract
A power electronic system including a casing encapsulating a circuit board and multiple power electronic components mounted to a first broad face of the circuit board. The casing includes a case body, a first lid, and a second lid. The case body includes a cooling channel region including a cooling plate having a first and second broad face, cooling features extending from the cooling plate first broad face, and a cooling block extending from the cooling plate second broad face. The case body further includes a first access gap defined through the case body. The circuit board is mounted to the casing with the first broad face proximal the cooling plate second broad face. The power electronic system additionally includes a connector that extends from the case exterior to connect to the circuit board first broad face, wherein connector connection is facilitated by the first access gap.
-
Citations
27 Claims
-
1. A power electronic system, comprising:
-
a casing comprising; a case body comprising;
a cooling channel region partially defining a cooling channel, the cooling channel region comprising;
a cooling plate having a first and a second opposing broad face, the first broad face adjacent the cooling channel, cooling features extending from the first broad face of the cooling plate, and a cooling block extending from the second broad face of the cooling plate, the case body further comprising a first access gap defined through the case body;a first lid that mounts to the case body proximal the first broad face of the cooling plate and cooperatively defines the cooling channel with the case body; a second lid that mounts to the case body proximal the second broad face of the cooling plate; a coolant inlet and a coolant outlet fluidly connected to the cooling channel; a circuit board having a first and a second broad face, wherein the first broad face of the circuit board is mounted to the case body proximal the second broad face of the cooling plate between the case body and the second lid; a primary electronic component mounted to the first broad face of the circuit board; a cooling receptacle cooperatively enclosing the passive electronic component with the first broad face of the circuit board, the cooling receptacle thermally connected to the second broad face of the cooling plate; a secondary electronic component mounted to the first broad face of the circuit board, the secondary electric component thermally connected to the cooling block along a first broad face of the secondary electronic component; and a retention mechanism extending through a circuit board thickness from the second broad face of the circuit board to bias the secondary electronic component against the cooling block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A power electronic system, comprising:
-
a casing comprising; a case body defining;
a cooling channel encapsulating a plurality of cooling features extending from a first broad face of a cooling plate and a cooling block extending from a second broad face of the cooling plate, the second broad face opposing the first broad face, a first access gap, defined through a case body thickness, having a first and second opening, and a second access gap, defined through the case body thickness, having a first and second opening;a first lid that mounts to the case body and seals the second openings of the first and second access gaps, the first lid thermally connected to the cooling channel; a second lid that mounts to the case body proximal the first openings of the first and second access gaps; a circuit board having a first and a second broad face, the circuit board mounted between the case body and the second lid with the first broad face of the circuit board mounted to the case body, the circuit board extending over the cooling channel, first access gap, and second access gap, the circuit board comprising; a connector pin mounted to the first broad face of the circuit board, the connector pin aligned with the first access gap; an active electronic component mounted to the first broad face of the circuit board, the active electronic component thermally connected to the cooling block; a passive electronic component mounted to the first broad face of the circuit board, the passive electronic component aligned with the second access gap; and a connector that extends from an exterior of a case body wall defining the first access gap through the first access gap and connects to the connector pin. - View Dependent Claims (20, 21, 22, 23, 24, 25, 27)
-
-
26. A method of assembling a power electronic system, comprising:
-
assembling a cooling receptacle encapsulating a primary element encased within a potting compound to a first broad face of a circuit board; assembling a secondary electronic component to the first broad face of the circuit board at an angle to a normal vector to the first broad face of the circuit board; mounting the first broad face of the circuit board to a first side of a case body, the case body comprising;
a cooling channel comprising a plurality of cooling features, the cooling channel defined on a second side of the case body opposing the first side, a cooling block extending from the first side of from the first side to the second side of the case body, the first access gap adjacent the cooling channel along a case body width, and a second access gap extending from the first side to the second side of the case body, the second access gap opposing the first access gap across the cooling channel;inserting a retention mechanism from a second face of the circuit board, through the circuit board, to the first face of the circuit board to bias and thermally connect the secondary electronic component against the cooling block; mounting a second lid to the first side of the case body and encapsulating the circuit board between the second lid and the case body; connecting a connector from an exterior of the case body to the circuit board through the second access gap; and mounting a first lid to the second side of the case body to seal an end of the first and second access gaps.
-
Specification