SEMICONDUCTOR ELEMENT HAVING HIGH BREAKDOWN VOLTAGE
First Claim
1. A semiconductor element having a high breakdown voltage, comprising:
- a substrate;
a buffer layer, disposed on the substrate, comprising a first high edge dislocation defect density area;
a semiconductor composite layer, disposed on the buffer layer, comprising a second high edge dislocation defect density area formed due to the first high edge dislocation defect density area; and
a bias electrode, disposed on the semiconductor composite layer;
wherein, the first and second high edge dislocation defect density areas generating a virtual gate effect of defect energy level capturing electrons to form an extended depletion region expanded from the bias electrode at the semiconductor composite layer.
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Abstract
A semiconductor element having a high breakdown voltage includes a substrate, a buffer layer, a semiconductor composite layer and a bias electrode. The buffer layer disposed on the substrate includes a high edge dislocation defect density area. The semiconductor composite layer disposed on the buffer layer includes a second high edge dislocation defect density area formed due to the first high edge dislocation defect density area. The bias electrode is disposed on the semiconductor composite layer. A virtual gate effect of defect energy level capturing electrons is generated due to the first and second high edge dislocation defect density areas, such that an extended depletion region expanded from the bias electrode is formed at the semiconductor composite layer. When the bias electrode receives a reverse bias, the extended depletion region reduces a leakage current and increases the breakdown voltage of the semiconductor element.
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Citations
12 Claims
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1. A semiconductor element having a high breakdown voltage, comprising:
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a substrate; a buffer layer, disposed on the substrate, comprising a first high edge dislocation defect density area; a semiconductor composite layer, disposed on the buffer layer, comprising a second high edge dislocation defect density area formed due to the first high edge dislocation defect density area; and a bias electrode, disposed on the semiconductor composite layer; wherein, the first and second high edge dislocation defect density areas generating a virtual gate effect of defect energy level capturing electrons to form an extended depletion region expanded from the bias electrode at the semiconductor composite layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification