Thin Plate Vibration Device and a Method of Producing the Same

• US 20130241351A1
• Filed: 03/08/2013
• Published: 09/19/2013
• Est. Priority Date: 03/19/2012
• Status: Abandoned Application

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Kondo, Jungo, Iwata, Yuichi, Ejiri, Tetsuya
• Application Number:
  US13/789,837
• Publication Number:
  US 20130241351A1
• Time in Patent Office: Days
• US Class Current: 310/323.01
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/082 by etching, e.g. lithography
• CPC Class Codes: H10N 30/20 with electrical input and mechanical output, e.g. functioning as actuators or vibrators
• CPC Class Codes: H10N 30/306 Cantilevers

Abstract

A thin plate type vibration device 10 includes a vibration layer 2 composed of an oxide single crystal. The vibration layer 2 includes a first main face 2a and a second main face 2b, and further includes a fixed end part 2e, a free end part 2c and a central vibration part 2d provided between the fixed end part and free end part. The device 10 further includes an anchor part 7 composed of an oxide single crystal or a silicon single crystal and bonded to the fixed end part 2e of the vibration layer 2 at the first main face 2a. The device further includes a weight part 6 composed of an oxide single crystal or a silicon single crystal and bonded to the free end part 2c at the first main face 2a.

Claims

1. A thin plate type vibration device comprising:

a vibration layer comprising an oxide single crystal, a first main face and a second main face, said vibration layer further comprising a fixed end part, a free end part and a central vibration part provided between said fixed end part and said free end part;

an anchor part comprising an oxide single crystal or a silicon single crystal, said anchor part bonded to said fixed end part of said vibration layer at said first main face; and

a weight part comprising an oxide single crystal or a silicon single crystal, said weight part bonded to said free end part at said first main face.

2. The device of claim 1, wherein said oxide single crystal or silicon single crystal forming said anchor part is same as that forming said weight part.

3. The device of claim 1, wherein said second main face of said vibration layer faces a space over the whole of said second main face.

4. The device of claim 1, further comprising:

a second anchor part comprising an oxide single crystal or a silicon single crystal, said second anchor part bonded to said fixed end part of said vibration layer at said second main face; and

a second weight part comprising an oxide single crystal or a silicon single crystal, said second weight part bonded to said free end part at said second main face.

5. The device of claim 4, wherein said oxide single crystal or silicon single crystal forming said second anchor part is same as that forming said second weight part.

6. The device of claim 1, wherein said oxide single crystal forming said vibration layer is anisotropic, and wherein said vibration layer comprises an X plate or Y plate in a crystal axis at said main faces.

7. The device of claim 1, wherein said anchor part and said weight part are formed by wet etching of a flat plate comprising said oxide single crystal or said silicon single crystal.

8. The device of claim 4, wherein said second anchor part and said second weight part are formed by wet etching of a flat plate comprising said oxide single crystal or said silicon single crystal.

9. A method of producing the thin plate type vibration device of claim 1, the method comprising the steps of:

bonding said first main face of said vibration layer to a flat plate comprising said oxide single crystal or said silicon single crystal; and

subjecting said flat plate to wet etching to form said anchor part and said weight part.

10. A method of producing the thin plate-type vibration device of claim 4, the method comprising the steps of:

bonding said second main face of said vibration layer to a flat plate comprising said oxide single crystal or said silicon single crystal; and

subjecting said flat plate to wet etching to form said second anchor part and said second weight part.