MULTILAYER CERAMIC ELECTRONIC COMPONENT

• US 20130242457A1
• Filed: 01/18/2013
• Published: 09/19/2013
• Est. Priority Date: 03/13/2012
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: SEO, Dong Hwan, LEE, Chang Ho, PARK, Sang Hyun
• Granted Patent: US 8,861,181 B2
• Time in Patent Office: Days
• US Class Current: 361/301.4
• CPC Class Codes: H01G 4/008 Selection of materials
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/2325 characterised by the material of the terminals
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer, and T2 is a thickness of the second layer, Tc≦70 μm, T2≧(1.5)T1, and L1<(1.5)Tc are satisfied, thus providing excellent reliability.

Claims

1. A multilayer ceramic electronic component, comprising:

a ceramic main body having internal electrodes laminated therein; and

external electrodes formed on both ends of the ceramic main body in a length direction thereof,

wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and

when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer at either end of the ceramic main body in a thickness direction thereof, and T2 is a thickness of the second layer at either end of the ceramic main body in the thickness direction thereof, Tc≦

70 μ

m, T2≧

(1.5)T1, and L1<

(1.5)Tc are satisfied.

2. The multilayer ceramic electronic component of claim 1, wherein the multilayer ceramic electronic component is 1005-sized or greater.

3. The multilayer ceramic electronic component of claim 1, wherein, when L2 is a length from either end of the ceramic main body in the length direction thereof to an end of the second layer formed on the upper surface or the lower surface of the ceramic main body, (1.5)L1≦

L2 is satisfied.

4. The multilayer ceramic electronic component of claim 1, wherein, when L2 is a length from either end of the ceramic main body in the length direction thereof to an end of the second layer formed on the upper surface or the lower surface of the ceramic main body, and L is a length of the ceramic main body, L2 (⅓

)L is satisfied.

5. The multilayer ceramic electronic component of claim 1, wherein, when L2 is a length from either end of the ceramic main body in the length direction thereof to an end of the second layer formed on the upper surface or the lower surface of the ceramic main body, and L is a length of the ceramic main body, (1.5)L1≦

L2≦

(⅓

)L is satisfied.

6. The multilayer ceramic electronic component of claim 1, wherein the conductive metal includes at least one selected from the group consisting of gold, silver, palladium, copper, nickel, and alloys thereof.

7. The multilayer ceramic electronic component of claim 1, wherein the conductive resin includes at least one selected from the group consisting of a silver (Ag)-epoxy resin, a copper (Cu)-epoxy resin, and a copper (Cu)-coated silver (Ag) resin.

8. A multilayer ceramic electronic component, comprising:

a ceramic main body having internal electrodes alternately laminated therein; and

external electrodes formed on both ends of the ceramic main body in a length direction thereof,

wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and

when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, L2 is a length from either end of the ceramic main body in the length direction thereof to an end of the second layer formed on the upper surface or the lower surface of the ceramic main body, and L is a length of the ceramic main body, Tc≦

70 μ

m and (1.5)L1≦

L2≦

(⅓

)L are satisfied.

9. The multilayer ceramic electronic component of claim 8, wherein the multilayer ceramic electronic component is 1005-sized or greater.

10. The multilayer ceramic electronic component of claim 8, wherein the multilayer ceramic electronic component satisfies L1<

(1.5)Tc.

11. The multilayer ceramic electronic component of claim 8, wherein, when T1 is a thickness of the first layer at either end of the ceramic main body in a thickness direction thereof, and T2 is a thickness of the second layer at either end of the ceramic main body in the thickness direction thereof, T2≧

(1.5)T1 is satisfied.

12. The multilayer ceramic electronic component of claim 11, wherein the multilayer ceramic electronic component satisfies L1<

(1.5)Tc.

13. The multilayer ceramic electronic component of claim 8, wherein the conductive metal includes at least one selected from the group consisting of gold, silver, palladium, copper, nickel, and alloys thereof.

14. The multilayer ceramic electronic component of claim 8, wherein the conductive resin includes at least one selected from the group consisting of a silver (Ag)-epoxy resin, a copper (Cu)-epoxy resin, and a copper (Cu)-coated silver (Ag) resin.