LASER DIODE ARRAY AND LASER DIODE UNIT

• US 20130243019A1
• Filed: 03/12/2013
• Published: 09/19/2013
• Est. Priority Date: 03/15/2012
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ono, Tomoki, Wakabayashi, Kazuya
• Application Number:
  US13/796,656
• Publication Number:
  US 20130243019A1
• Time in Patent Office: Days
• US Class Current: 372/36
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/024 Arrangements for thermal management
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
• CPC Class Codes: H01S 5/2231 with inner confining structure only between the active layer and the upper electrode
• CPC Class Codes: H01S 5/4018 Lasers electrically in series
• CPC Class Codes: H01S 5/4031 Edge-emitting structures
• CPC Class Codes: H01S 5/405 Two-dimensional arrays
• CPC Class Codes: H01S 5/4087 emitting more than one wavelength

Abstract

A laser diode array includes: a heat dissipator; a plurality of submounts disposed independently of one another on the heat dissipator; and a plurality of laser diode devices including two or more kinds of laser diode devices with different oscillation wavelengths, the laser diode devices being disposed on the respective submounts, and being electrically connected to one another.

Claims

1. A laser diode array comprising:

a heat dissipator;

a plurality of submounts disposed independently of one another on the heat dissipator; and

a plurality of laser diode devices including two or more kinds of laser diode devices with different oscillation wavelengths, the laser diode devices being disposed on the respective submounts, and being electrically connected to one another.

2. The laser diode array according to claim 1, wherein the plurality of laser diode devices are arranged at equal intervals.

3. The laser diode array according to claim 1, wherein the plurality of laser diode devices are arranged at intervals of about 2 mm to about 10 mm both inclusive.

4. The laser diode array according to claim 1, wherein a half-width of a superimposition of wavelength spectra of the plurality of laser diode devices is about 2 nm or more.

5. The laser diode array according to claim 1, wherein the plurality of laser diode devices are electrically connected to one another in series.

6. The laser diode array according to claim 1, wherein the plurality of laser diode devices are electrically connected to one another in parallel.

7. The laser diode array according to claim 1, wherein the plurality of laser diode devices are configured of the same material-based devices.

8. The laser diode array according to claim 1, wherein the laser diode devices are made of an AlGaInP-based material.

9. The laser diode array according to claim 1, wherein the laser diode devices are made of a GaN-based material.

10. The laser diode array according to claim 1, wherein the plurality of laser diode devices include two or more kinds of laser diode devices with different stripe widths.

11. The laser diode array according to claim 1, wherein the plurality of laser diode devices each have a pair of resonator facets at two facing side surfaces, and include two or more kinds of laser diode devices with different resonator lengths.

12. The laser diode array according to claim 1, further comprising a base plate for fixing,

wherein a surface different from a surface where the laser diode devices are mounted of the heat dissipator is fixed on the base plate.

13. The laser diode array according to claim 1, further comprising a base plate for fixing,

wherein a surface inclined at about 90°

from a surface where the laser diode devices are mounted of the heat dissipator is fixed on the base plate.

14. The laser diode array according to claim 1, wherein the submounts are made of an insulating material.

15. A laser diode unit including a plurality of laser diode arrays, each of the laser diode arrays comprising:

a heat dissipator;

a plurality of submounts disposed independently of one another on the heat dissipator; and

a plurality of laser diode devices including two or more kinds of laser diode devices with different oscillation wavelengths, the laser diode devices being disposed on the respective submounts, and being electrically connected to one another.

16. The laser diode unit according to claim 15, wherein the plurality of laser diode arrays are disposed along a direction orthogonal to a direction where the plurality of laser diode devices are arranged.

17. The laser diode unit according to claim 15, wherein the plurality of laser diode arrays are arranged along directions the same as and orthogonal to a direction where the plurality of laser diode devices are arranged.

18. The laser diode unit according to claim 15, wherein a half-width of a superimposition of wavelength spectra of the plurality of laser diode arrays is about 4 nm or more.