INTERPOSER AND ELECTRICAL TESTING METHOD THEREOF
First Claim
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1. An interposer, comprising:
- a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads;
a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and
a first removable electrical connection structure formed on the first surface and electrically connected to a portion of the first conductive pads.
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Abstract
An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.
21 Citations
23 Claims
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1. An interposer, comprising:
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a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connected to a portion of the first conductive pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An electrical testing method of an interposer, comprising the steps of:
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providing an interposer, the interposer comprising; a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads; electrically connecting a plurality of probes to the interposer to test the interposer; and removing the first removable electrical connection structure. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification