BUILT-IN ANTENNA DEVICE FOR ELECTRONIC COMMUNICATION DEVICE

• US 20130249744A1
• Filed: 02/15/2013
• Published: 09/26/2013
• Est. Priority Date: 03/26/2012
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Dong-Hwan, KIM, Austin, KIM, Se-Ho, SA, Kong-Min, LEE, Jae-Ho, JANG, Soo-Young, JANG, Byung-Chan, HWANG, In-Jin
• Granted Patent: US 9,799,964 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 21/30 Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

A built-in antenna device for an electronic device for communication used in a multi-band is provided. The built-in antenna device includes a PCB, a first antenna radiator disposed on the PCB, and a second antenna radiator which has the same power feeding point as the first antenna radiator and is disposed at a housing of the electronic device, wherein the first antenna radiator and the second antenna radiator are configured to operate at different frequency bands.

Claims

1. A built-in antenna device for an electronic communication device, the built-in antenna device comprising:

a PCB;

a first antenna radiator disposed on the PCB; and

a second antenna radiator which has the same power feeding point as the first antenna radiator and is disposed at a housing of the electronic device;

wherein the first antenna radiator and the second antenna radiator are configured to operate in different frequency bands.

2. The built-in antenna device of claim 1, wherein the first antenna radiator is directly formed as a metal pattern on the PCB.

3. The built-in antenna device of claim 1, wherein the second antenna radiator is a wire type antenna radiator fixed to an inner side of the housing.

4. The built-in antenna device of claim 1, wherein the second antenna radiator is at least one of a metal plate of a defined pattern attached to an inner side of the case frame, and an FPC including a metal pattern.

5. The built-in antenna device of claim 1, wherein the second antenna radiator is a metal body having an insert-molded pattern within the housing

6. The built-in antenna device of claim 1, wherein, when the PCB is assembled to the housing, a power feeding terminal of the second antenna radiator is electrically connected with the power feeding portion of the first antenna radiator.

7. The built-in antenna device of claim 6, further comprising an electrical connection means for connecting the first antenna radiator with the second antenna radiator.

8. The built-in antenna device of claim 7, wherein the electrical connection means is one of a C-clip and a conductive tape which have elasticity and are attached to the power feeding portion of the first antenna radiator and wherein the electrical connection means has elasticity and comes in contact with the power feeding terminal of the second antenna radiator when the PCB and the case frame are assembled.

9. The built-in antenna device of claim 1, wherein the first antenna radiator is configured to operate in a frequency band which is higher than that of the second antenna radiator.

10. The built-in antenna device of claim 9, wherein the first antenna radiator is implemented to operate in at least one frequency band of DCS 1800, PCS 1900, WCDMA series, and LTE series and wherein the second antenna radiator is implemented to operate in at least one frequency band of GSM850 and GSM900.

11. The built-in antenna device of claim 1, wherein the second antenna radiator includes:

a wire portion of a defined shape and length, which is fixed to an inner side of the housing; and

a terminal portion which is integrated with the wire portion at one end of the wire portion and is electrically coupled to the PCB.

12. The built-in antenna device of claim 11, wherein the terminal portion is formed by forming one end portion of the wire portion as a plane by rolling and performing electroless plating with at least one conductive material.

13. The built-in antenna of claim 11, further comprising a plurality of fixing protrusions, which are protruded and formed at regular intervals, at an internal side of the housing, wherein the wire portion is supported to the protrusions, is fused by heat, and is closely fixed to an internal surface of the housing.

14. The built-in antenna of claim 13, wherein the terminal portion is formed by forming one end portion of the wire portion as a plane by performing electroless plating.

15. An electronic communication device comprising:

a built-in antenna device comprising;

a PCB;

a first antenna radiator disposed on the PCB; and

a second antenna radiator which has the same power feeding point as the first antenna radiator and is disposed within the electronic device but not on the PCB,

wherein the first antenna radiator and the second antenna radiator are configured to operate in different frequency bands.

16. The electronic device of claim 15, wherein the second antenna radiator is disposed at a housing of the electronic device.

17. The electronic device of claim 15, wherein the second antenna radiator is a wire type antenna radiator fixed to an inner side of the housing.

18. The electronic device of claim 15, wherein the second antenna radiator is at least one of a metal plate of a pattern shape attached to an inner side of the housing and an FPC including a pattern.

19. The electronic device of claim 15, wherein the second antenna radiator is a metal body which has an insert-molded radiation pattern on a case frame of the electronic device.

20. The electronic device of claim 16, wherein, when the PCB is assembled to the housing of the electronic device, a power feeding terminal of the second antenna radiator is electrically connected with the power feeding portion of the first antenna radiator.