COMPRESSIBLE CONDUCTIVE ELEMENT FOR USE IN CURRENT-CARRYING STRUCTURE

• US 20130250471A1
• Filed: 03/12/2013
• Published: 09/26/2013
• Est. Priority Date: 03/22/2012
• Status: Abandoned Application

• Current Assignee: Component Re-Engineering Co. Inc. (Watlow Electric Manufacturing Company)
• Original Assignee: Component Re-Engineering Co. Inc. (Watlow Electric Manufacturing Company)
• Inventors: REX, Dennis George
• Application Number:
  US13/797,467
• Publication Number:
  US 20130250471A1
• Time in Patent Office: Days
• US Class Current: 361/234
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks

Abstract

An electrostatic chuck is provided and can include a body having a surface for receiving a wafer. An electrode can be embedded in the body and spaced beneath the surface by a layer. A compressible element having a first end portion electrically coupled to the electrode and a second end portion coupleable to the electrical connector can be provided to inhibit damage to the exposed portion of the electrode and the layer during use. Other embodiments of an electrostatic chuck and embodiments of a conductive element are provided, and an embodiment of a wafer heater is provided.

Claims

1. An electrostatic chuck for use with a wafer and an electrical connector, comprising a body having a surface adapted for receiving the wafer, an electrode embedded in the body and spaced beneath the surface by a layer of the body, an access port in the body exposing a portion of the electrode, the exposed portion of the electrode and the layer being relatively thin and fragile, and a compressible element having a first end portion electrically coupled to the electrode and a second end portion coupleable to the electrical connector whereby the compressibility of the compressible element during use inhibits damage to the exposed portion of the electrode and the layer.

2. The electrostatic chuck of claim 1, wherein the compressible element has a bellows portion.

3. The electrostatic chuck of claim 2, wherein the exposed portion of the electrode has an area and wherein the bellows portion has a planar surface with a cross-sectional area approximating the area of the exposed portion of the electrode for inhibiting the formation of concentrated loads to the exposed portion of the electrode and the layer.

4. An electrostatic chuck for use with a wafer and an electrical connector, comprising a body having a surface adapted for receiving the wafer, an electrode embedded in the body and spaced beneath the surface by a layer of the body, an access port in the body exposing a portion of the electrode having an area, the exposed portion of the electrode and the layer being relatively thin and fragile, and a conductive element having a first end portion provided with a planar surface with a cross-sectional area approximating the area of the exposed electrode that is electrically coupled to the electrode and a second end portion coupleable to the electrical connector whereby the planar surface provides structural support to the exposed portion of the electrode and the layer.

5. The electrostatic chuck of claim 4, wherein the conductive element extends along a longitudinal axis and includes at least one flexible element that is compressible along the longitudinal axis.

6. A conductive element for use with a wafer and an electrostatic chuck having a surface for receiving the wafer and an electrode embedded in the chuck and spaced beneath the surface by a layer of the chuck and an access port in the chuck exposing a portion of the electrode which together with the layer is relatively thin and fragile, comprising a hollow body of a conductive material that extends along a longitudinal axis, the body including a bellows portion adapted for electrical coupling to the portion of the electrode, the bellows portion being sized and shaped for placement in the access port and being compressible along the longitudinal axis.

7. The conductive element of claim 6, wherein the bellows portion includes a plurality of flexible elements that are compressible along the longitudinal axis.

8. The conductive element of claim 6, wherein the exposed portion of the electrode has an area and wherein the bellows portion has a planar surface with a cross-sectional area approximating the area of the exposed portion of the electrode for providing structural support to the exposed portion of the electrode and the layer.

9. A wafer heater for use with a wafer, comprising a disk having a surface adapted for receiving the wafer, a heating element embedded in the disk and having first and second ends, a chamber mount and a shaft extending between the disk and the chamber mount and being provided with an internal passageway, first and second conductors extending through the chamber mount and the internal passageway of the shaft and electrically coupled respectively to the first and second ends of the heater element, the first and second conductors having a coefficient of thermal expansion and the disk, the shaft and the chamber mount each having a coefficient of thermal expansion different than the coefficient of thermal expansion of the first and second conductors, each of the first and second conductors including a compressible portion for inhibiting damage to the first and second conductors from disparate coefficients of thermal expansion during operation of the wafer heater.

10. The wafer heater of claim 9, wherein the compressible element has a bellows portion.

11. A conductive element for use in a current-carrying structure having a first portion and a second portion, comprising a hollow body of a conductive material adapted to couple the first portion to the second portion, the hollow body extending along a longitudinal axis and including a bellows portion that is compressible along the longitudinal axis for accommodating stresses experienced by the current-carrying structure.

12. The conductive element of claim 11, wherein the bellows portion includes a plurality of flexible elements that are compressible along the longitudinal axis.

13. The conductive element of claim 11, wherein the current-carrying structure is a conductor in a wafer heater, the conductor having a first portion and a second portion.

14. The conductive element of claim 11, wherein the first portion of the current-carrying structure is an electrode in an electrostatic chuck and the second portion of the current-carrying structure is an electrical connector.