HEAT-REDUCTION METHODS AND SYSTEMS RELATED TO MICROFLUIDIC DEVICES
First Claim
1. An integrated microfluidic processing system comprising a microfluidic device, the device comprising:
- a microfluidic complex comprising at least one thermally actuated component;
a thermally insulating substrate comprising a heating element configured to actuate the thermally actuated component; and
at least one conductive lead for supplying electrical current from a current source to the heating element, wherein the lead has a lower current density that the heating element.
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Abstract
The present relates to a system and method for preventing or reducing unwanted heat in a microfluidic of the device while generating heat in selected regions of the device. Current can be supplied to a heating element through electric leads that are designed so that the current density in the leads is substantially lower than the current density in the heating element. Unwanted heat in the microfluidic complex can be reduced by thermally isolating the electric leads from the microfluidic complex by, for example, running each lead directly away from the microfluidic complex. Unwanted heat can be removed from selected regions of the microfluidic complex using one or more cooling devices.
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Citations
1 Claim
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1. An integrated microfluidic processing system comprising a microfluidic device, the device comprising:
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a microfluidic complex comprising at least one thermally actuated component; a thermally insulating substrate comprising a heating element configured to actuate the thermally actuated component; and at least one conductive lead for supplying electrical current from a current source to the heating element, wherein the lead has a lower current density that the heating element.
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Specification