THIN-FILM LED WITH P AND N CONTACTS ELECTRICALLY ISOLATED FROM THE SUBSTRATE
First Claim
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1. A method of manufacturing a thin-film light emitting diode, comprising:
- forming an epitaxial structure on a growth substrate, the epitaxial structure comprising a first epitaxial layer, a second epitaxial layer, and an active region between the first epitaxial layer and the second epitaxial layer;
forming an electrode layer on the second epitaxial layer of the epitaxial structure;
attaching a substrate with a conductive adhesive layer to the electrode layer such that the electrode layer and the conductive adhesive layer together form a metallic current spreading layer;
removing the growth substrate.
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Abstract
A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode.
7 Citations
9 Claims
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1. A method of manufacturing a thin-film light emitting diode, comprising:
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forming an epitaxial structure on a growth substrate, the epitaxial structure comprising a first epitaxial layer, a second epitaxial layer, and an active region between the first epitaxial layer and the second epitaxial layer; forming an electrode layer on the second epitaxial layer of the epitaxial structure; attaching a substrate with a conductive adhesive layer to the electrode layer such that the electrode layer and the conductive adhesive layer together form a metallic current spreading layer; removing the growth substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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