INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME
First Claim
1. A method for forming a core layer of an information carrying card, comprising:
- forming a first thermoplastic layer having at least one cavity, the first thermoplastic layer comprising at least one thermoplastic material;
disposing an inlay layer of printed circuit board (PCB) partially or fully into the at least one cavity, the inlay layer of PCB comprising at least one integrated circuit, at least one wire and a supporting film; and
dispensing a crosslinkable polymer composition over the inlay layer in the at least one cavity, the crosslinkable polymer composition comprising;
a curable base polymer resin in a liquid or paste form, the base polymer resin selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and
a particulate thermoplastic filler.
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Accused Products
Abstract
The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.
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Citations
25 Claims
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1. A method for forming a core layer of an information carrying card, comprising:
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forming a first thermoplastic layer having at least one cavity, the first thermoplastic layer comprising at least one thermoplastic material; disposing an inlay layer of printed circuit board (PCB) partially or fully into the at least one cavity, the inlay layer of PCB comprising at least one integrated circuit, at least one wire and a supporting film; and dispensing a crosslinkable polymer composition over the inlay layer in the at least one cavity, the crosslinkable polymer composition comprising; a curable base polymer resin in a liquid or paste form, the base polymer resin selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and a particulate thermoplastic filler. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification