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PLATING METHOD AND PLATING APPARATUS

  • US 20130255360A1
  • Filed: 03/22/2013
  • Published: 10/03/2013
  • Est. Priority Date: 03/27/2012
  • Status: Active Grant
First Claim
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1. A plating method comprising:

  • holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder;

    performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and

    if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

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