METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY HAVING A SHAPED BODY

• US 20130258615A1
• Filed: 12/09/2011
• Published: 10/03/2013
• Est. Priority Date: 12/14/2010
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Grauf, Gerhard
• Application Number:
  US13/994,601
• Publication Number:
  US 20130258615A1
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The invention relates to a method for producing an electronic assembly (1) having at least one electronic component (3, 4) and a shaped body (2) which at least partially surrounds the electronic component (3, 4), comprising the following steps: at least one electronic component (3, 4) is placed into an open mould (10), a first moulding material (21) and a second moulding material (22) are supplied to a cavity (13) in the mould (10), wherein the first moulding material is different from the second moulding material, and the mould (10) is closed, wherein the mould (10) is closed before or at the same time as the first and second moulding materials (21, 22) are supplied.

Claims

1. A method for producing an electronic assembly (1) having at least one electronic component (3, 4) and a shaped body (2) at least partly surrounding the electronic component (3, 4), comprising the steps:

inserting at least one electronic component (3, 4) into an opened mold (10),

supplying a first molding material (21) and a second molding material (22) to a cavity (13) in the mold (10), the first molding material being different from the second molding material, and

closing the mold (10),

the mold (10) being closed before or at the same time as the first and second molding material (21, 22) are supplied.

2. The method as claimed in claim 1, characterized in that the first and second molding material (21, 22) are supplied simultaneously.

3. The method as claimed in claim 1, characterized in that the first molding material (21) is supplied by a first piston (18) and the second molding material (22) is supplied by a second piston (19).

4. The method as claimed in claim 1, characterized by a separating element (6), which is placed on the electronic component (3, 4) or which is fixed to the electronic component (3, 4), the separating element providing, with a mold wall (12a), a subdivision of the cavity (13) in the mold (10).

5. The method as claimed in claim 1, characterized by a guide element (7) for guiding the molding material supplied in the cavity (13), the guide element (7) being provided as an insert part and/or fixed to the mold and/or fixed to the electronic component.

6. The method as claimed in claim 1, characterized in that the first and second molding material (21, 22) are supplied to the mold (10) from mutually opposite sides.

11. The method as claimed in claim 1, characterized by a guide element (7) for guiding the molding material supplied in the cavity (13), the guide element (7) being provided as an insert part.

12. The method as claimed in claim 1, characterized by a guide element (7) for guiding the molding material supplied in the cavity (13), the guide element (7) being fixed to the mold.

13. The method as claimed in claim 1, characterized by a guide element (7) for guiding the molding material supplied in the cavity (13), the guide element (7) being fixed to the electronic component.

7. An electronic assembly, comprising at least one electronic component (3, 4) and a shaped body (2) at least partly surrounding the electronic component (3, 4), the shaped body (2) comprising at least a first molding material (21) and a second molding material (22), and the first molding material (21) being different from the second molding material (22).

8. The assembly as claimed in claim 7, further comprising at least one separating element (6), which is arranged in the shaped body (2) and separates the first molding material (21) from the second molding material (22).

9. The assembly as claimed in claim 8, characterized in that the separating element is an electronic component or in that the separating element (6) is circumferentially closed, in order to form a cavity (30) in the shaped body (2).

10. The assembly as claimed in claim 7, further comprising at least one guide element (7) which is arranged in the shaped body (2), the guide element (7) having guided molding material in the cavity (13) of the mold (10).