METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGUIDE DEVICE

• US 20130259421A1
• Filed: 12/11/2012
• Published: 10/03/2013
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: YAMAKAMI, Takatoyo, KUBOTA, Takashi, ISHIKAWA, Kuniko, KIRA, Hidehiko
• Granted Patent: US 8,861,903 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: B29D 11/00663 Production of light guides
• CPC Class Codes: B29D 11/00721 involving preforms for the manufacture of light guides
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/125 Bends, branchings or intersections
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence

Abstract

A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface.

Claims

1. A method of manufacturing an optical waveguide device, the method comprising:

inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate;

locating an optical component above an opening of the through hole on the other surface side of the substrate;

injecting an underfill material into between the optical component and the other surface and into the through hole; and

curing the underfill material to form a mirror surface.

2. The method according to claim 1, wherein the mirror surface optically couples the optical waveguide member to the optical component.

3. The method according to claim 1, wherein the underfill material is an epoxy resin or a urethane resin.

4. The method according to claim 1, further comprising:

pulling out the inclined surface inserted into the through hole from the through hole after the underfill material is cured; and

forming a reflection film on the mirror surface.

5. The method according to claim 1, wherein

the optical waveguide member includes a plurality of optical paths, and

the through hole is formed so as to extend across the plurality of optical paths.

6. The method according to claim 5, wherein

the mold includes a base portion and a projection which projects from the base portion and in which the inclined surface is formed, and

the inclined surface is inserted into the through hole so as to be located across the plurality of optical paths.

7. The method according to claim 1, wherein

the optical waveguide member includes a plurality of optical paths, and

a plurality of the through holes are formed at each of the plurality of optical paths.

8. The method according to claim 7, wherein

the mold includes a base portion and a plurality of projections which project from the base portion and in each of which the inclined surface is formed, and

the plurality of projections are inserted into the through hole so as to be located at the plurality of corresponding optical paths.

9. The method according to claim 1, wherein

the substrate is located on a board, and

a through hole is formed in the board so as to communicate with the through hole of the optical waveguide.

10. The method according to claim 1 further comprising, inserting the inclined surface into the through hole when the optical waveguide is placed on the mold.

11. The method according to claim 1, wherein

the mold is light-transmissive, and

the underfill material is a light-curable resin.

12. The method according to claim 11 further comprising, irradiating light through the mold for curing the underfill material.

13. An optical waveguide device comprising:

a substrate including an optical waveguide member and a through hole is formed;

an optical component mounted above an opening of the through hole on one surface side of the substrate; and

an underfill material injected into between the optical component and the one surface and into the through hole and having an inclined surface inclined relative to the one surface.